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1,1,5,5,5-Hexamethyl-3,3-bis[(trimethylsilyl)oxy]trisiloxan
TETRAKIS(TRIMETHYLSILYLOXY)SILANE · Tetrakis(trimethylsilyl) orthosilicate · Tetrakis(trimethylsilyl) silicate · Trisiloxane,1,1,1,5,5,5-hexamethyl-3,3-bis[(trimethylsilyl)oxy]- · DK275 · DK751 · loxy)DKFELEX0194 · Tetrakis(trimethylsietrakis(trimethylsilyl)silicate
![Molekülstruktur von 1,1,5,5,5-Hexamethyl-3,3-bis[(trimethylsilyl)oxy]trisiloxan](/img/chemical/19086.png)
Identifikatoren & physikalische Daten
| CAS No. | 3555-47-3 |
|---|---|
| Summenformel | C12H36O4Si5 |
| Durchschnittliche Molmasse | 384,84 g/mol |
| Monoisotopische Masse | 384,1459923 g/mol |
| SMILES | C[Si](C)(C)O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C |
| InChIKey | VNRWTCZXQWOWIG-UHFFFAOYSA-N |
| PubChem CID | 19086 |
| EC No. | 222-613-4 |
| DTXSID | DTXSID9042463 |
| Lokaler Name | 1,1,5,5,5-Hexamethyl-3,3-bis[(trimethylsilyl)oxy]trisiloxan |
Chemische & physikalische Eigenschaften
| Polarare Oberfläche (TPSA) | 36,9 |
|---|---|
| H-Brücken-Donoren | 0 |
| H-Brücken-Akzeptoren | 4 |
| Frei drehbare Bindungen | 8 |
| Schwere Atome | 21 |
| Formalladung | 0 |
| Komplexität | 266 |
| Stoffklassen | Metals -> Metalloid Compounds (Silicon) |
| SpringerMaterials Properties | Boiling point |
| Physical Description | Colorless liquid[Aldrich MSDS] |
| Schmelzpunkt | -60 °C |
| Siedepunkt | 103-106 °C/2 mmHg (lit.) |
| Dichte | 0.87 g/mL at 25 °C (lit.) |
| Dampfdruck | 27.4hPa at 20℃ |
| Brechungsindex | n20/D 1.389(lit.) |
| Flammpunkt | 169 °F |
| Lagerbedingungen | Inert atmosphere,Room Temperature |
| Aggregatzustand | liquid |
| Wichte | 0.868 |
| Farbe | Colorless to Almost colorless |
| Löslichkeit | 150.7ng/L at 23℃ |
| BRN | 1793898 |
| Henry-Konstante | 2.6×10-8 mol/(m3Pa) at 25℃, Ebert et al. (2023) |
| InChI | 1S/C12H36O4Si5/c1-17(2,3)13-21(14-18(4,5)6,15-19(7,8)9)16-20(10,11)12/h1-12H3 |
| InChIKey | VNRWTCZXQWOWIG-UHFFFAOYSA-N |
| SMILES | C[Si](C)(C)O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C |
| LogP (Verteilungskoeffizient) | 9 at 25℃ |
| EPA chemische Informationen | Tetrakis(trimethylsiloxy)silane (3555-47-3) |
Sicherheit & Vorschriften
| GHS-Einstufung | This chemical does not meet GHS hazard criteria for 15.9% (63 of 397) of reports.WarningH315 (51.6%): Causes skin irritation [Warning Skin corrosion/irritation]P261, P264, P264+P265, P271, P273, P280, P302+P352, P304+P340, P305+P351+P338, P319, P321, P332+P317, P337+P317, P362+P364, P403+P233, P405, and P501 (click each P-code to see the statement)Aggregated GHS information provided per 397 reports by companies from 6 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies. |
|---|---|
| Regulatorische Informationen | Chemical: Trisiloxane, 1,1,1,5,5,5-hexamethyl-3,3-bis[(trimethylsilyl)oxy]-Hazard Traits - BioaccumulationEnvironmental PersistenceREACH registered substance: 1,1,5,5,5-hexamethyl-3,3-bis[(trimethylsilyl)oxy]trisiloxane (EC: 222-613-4)Trisiloxane, 1,1,1,5,5,5-hexamethyl-3,3-bis(trimethylsilyl)oxy-: Does not have an individual approval but may be used as a component in a product covered by a group standard. It is not approved for use as a chemical in its own right. |
| Weitere Sicherheitsinformationen | IMAP assessments - Trisiloxane, 1,1,1,5,5,5-hexamethyl-3,3-bis[(trimethylsilyl)oxy]-: Human health tier I assessment |
| Gefahrenübersicht | A skin and strong eye irritant[Aldrich MSDS] See Octamethyltrisiloxane. See Dimethoxydimethylsilane. |
| Hazard Classes and Categories | Skin Irrit. 2 (51.6%) |
| Wassergefährdungsklasse (WGK) | 3 |
| TSCA-Inventar-Status | TSCA listed |
| UN-Transportnummer | NA1993 |
| Zollcode | 29319090 |
| R-Sätze (R) | 36/37/38 |
| Gefahrensymbole | Xi |
| Sicherheitshinweise (S) | 26-36 |
| Gefahrenklasse | CBLEye Irrit. 2Skin Irrit. 2STOT SE 3 |
| Lagerklasse | 10 - Combustible liquids |
Anwendungen & Verwendung
Verwenden
Tetrakis(trimethylsilyloxy)silane (TTMS) is an organosilicon compound used as a precursor to prepare nanostructured organosilicon polymer films by plasma-enhanced chemical vapor deposition (PECVD) at atmospheric pressure. TTMS along with cyclohexane can also be used to synthesize low dielectric constant SiCOH films by PECVD method.