Di-mu-hydroxo-[(N,N,N',N'-tetramethylethylenediamine)copper(II)] dichloride

HCID 2734061

Grundinformationen

Standard-SMILES: CN(C)CCN(C)C.CN(C)CCN(C)C.[Cl-].[Cl-].[Cu+2].[Cu+2].[OH-].[OH-]
InChIKey: XSGFQMSXIWLPOB-UHFFFAOYSA-J
Summenformel: C12H34Cl2Cu2N4O2
Durchschnittliche Molmasse: 464,4 g/mol

Bevorzugter Name: Di-mu-hydroxo-[(N,N,N',N'-tetramethylethylenediamine)copper(II)] dichloride
IUPAC: dicopper;bis(N,N,N',N'-tetramethylethane-1,2-diamine);dichloride;dihydroxide

Di-mu-hydroxo-[(N,N,N',N'-tetramethylethylenediamine)copper(II)] dichloridedicopper;N,N,N',N'-tetramethylethane-1,2-diamine;dichloride;dihydroxide

2.280

HRID 993520als KatalysatorChan-Lam coupling of primary sulfonamides with boronic acids

HRID 993521als KatalysatorChan-Lam coupling of primary sulfonamides with boronic acids

HRID 993522als KatalysatorChan-Lam coupling of primary sulfonamides with boronic acids

HRID 993523als KatalysatorChan-Lam coupling of primary sulfonamides with boronic acids

HRID 993524als KatalysatorChan-Lam coupling of primary sulfonamides with boronic acids

HRID 993525als KatalysatorChan-Lam coupling of primary sulfonamides with boronic acids

HRID 993526als KatalysatorChan-Lam coupling of primary sulfonamides with boronic acids

HRID 993527als KatalysatorChan-Lam coupling of primary sulfonamides with boronic acids

Wird geladen…