o-[(4-Hydroxyphenyl)methyl]phenol
2,4'-Dihydroxydiphenylmethane
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Grundinformationen
- CAS
2467-03-0- Standard-SMILES
Oc1ccc(Cc2ccccc2O)cc1- InChIKey
LVLNPXCISNPHLE-UHFFFAOYSA-N- Summenformel
- C13H12O2
- Durchschnittliche Molmasse
- 200,23 g/mol
- Monoisotopische Masse
- 200,08372962
Überblick
2,4'-bisphenol f has been reported in Xanthium strumarium with data available.
Namen und Bezeichner
- Bevorzugter Name
- 2,4'-Dihydroxydiphenylmethane
- IUPAC
- 2-[(4-hydroxyphenyl)methyl]phenol
- Lokaler Name
- o-[(4-Hydroxyphenyl)methyl]phenol
- Englischer Name
- 2,4'-Dihydroxydiphenylmethane
- Summenformel
- C13H12O2
- Molmasse
- 200.23
Namen und Synonyme
2,4'-Dihydroxydiphenylmethane2467-03-02,4'-Bisphenol F2,4'-Methylenediphenolo-(p-Hydroxybenzyl)phenolPhenol, 2,4'-methylenedi-LIX5YMK20BNSC-36395ortho, para-bisphenol F(2,4'-dihydroxyphenyl)methaneRefChem:442653219-579-8
Weitere Namen anzeigen
2,4’-bisphenolfo,p-Bisphenol FDihydroxydiphenylmethane(Methylenebisbenzene)-2,4'-diol
2-(4-hydroxybenzyl)phenol2-[(4-hydroxyphenyl)methyl]phenolPhenol, 2-[(4-hydroxyphenyl)methyl]-2,4'-Methylenebis(phenol)(2-Hydroxyphenyl)(4-hydroxyphenyl)methane4-[(2-hydroxyphenyl)methyl]phenolMFCD00060113Phenol, 2-((4-hydroxyphenyl)methyl)-
Datenbank-Bezeichner
- CAS
2467-03-0- PubChem CID
- 75576
- DTXSID
DTXSID2044890- ChEMBL
CHEMBL3187039- UNII
- LIX5YMK20B
- EC Number
- 219-579-8
Eigenschaften
Berechnete StruktureigenschaftenWird ergänzt
- XLogP
- 3,2
- Polarare Oberfläche (TPSA)
- 40,5 Ų
- H-Brücken-Donoren
- 2
- H-Brücken-Akzeptoren
- 2
- Frei drehbare Bindungen
- 2
- Schwere Atome
- 15
- Formalladung
- 0
- Komplexität
- 185
Experimentelle und physikochemische Eigenschaften
Chemical ClassesBisphenol
Endocrine DisruptorsPotential endocrine disrupting compound
Physikochemische Eigenschaften
- Schmelzpunkt
- 119 °C · 119 °C
- Siedepunkt
- 204 · 204-208 °C(Press: 6 Torr)
- Dichte
- 1.208 · 1.208±0.06 g/cm3(Predicted)
- storage temp.
- 2 · 2-8°C
- Löslichkeit
- Acetonitrile (Slightly), DMSO (Slightly)
- Aggregatzustand
- Solid
- pka
- 10.15 · 10.15±0.30(Predicted)
- Farbe
- White to Off-White
- Stabilität
- Hygroscopic
- InChI
- 1S/C13H12O2/c14-12-7-5-10(6-8-12)9-11-3-1-2-4-13(11)15/h1-8,14-15H,9H2
- InChIKey
- LVLNPXCISNPHLE-UHFFFAOYSA-N
Sicherheit und Regulatorisches
Sicherheitsangaben dienen nur zur Orientierung und ersetzen weder das Sicherheitsdatenblatt (SDB) des Lieferanten noch geltende Vorschriften oder eine fachliche Bewertung.
GHS-Klassifizierung
GHS Classification
This chemical does not meet GHS hazard criteria for 2.1% (1 of 47) of reports.
Danger
H317 (83%): May cause an allergic skin reaction [Warning Sensitization, Skin]
P203, P261, P264+P265, P271, P272, P273, P280, P302+P352, P304+P340, P305+P354+P338, P317, P318, P319, P321, P333+P317, P362+P364, P403+P233, P405, and P501 (click each P-code to see the statement)
Aggregated GHS information provided per 47 reports by companies from 5 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.
Gefahrenhinweise
Regulatory Information
Phenol, 2-[(4-hydroxyphenyl)methyl]- is listed on the EPA's Chemical Data Reporting (CDR) system. Manufacturers and importers of Phenol, 2-[(4-hydroxyphenyl)methyl]- are required to report information about their production and use of this chemical to the EPA under the Toxic Substances Control Act (TSCA). (40 eCFR Part 711)
Phenol, 2-(4-hydroxyphenyl)methyl-: Does not have an individual approval but may be used under an appropriate group standard
Hazard Classes and CategoriesSkin Sens. 1 (83%)
Sicherheitsdaten
- wgk
- WGK 3
- tsca
- TSCA listed
- hs_code
- 2907299090
- risk_code
- 36/37/38-62-43-41-37
- hazard_code
- Xn
- safety_code
- 26-36/37/39
- Speicherklasse
- 11 - Combustible Solids
Chemie und Industrie
Verwendung und Herstellung
U.S. Production2023: <50,000 lb
General Manufacturing InformationPhenol, 2-[(4-hydroxyphenyl)methyl]-: ACTIVE
Anwendungen
Beschreibungo-p'-Bisphenol F is allergenic components of phenol-formaldehyde resins resol-type.
Verwenden2,4''-Dihydroxydiphenylmethane can be used in anisotropically conductive paste containing thermosetting compd. and solder particles with improved reliability.
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