o-[(4-Hydroxyphenyl)methyl]phenol

2,4'-Dihydroxydiphenylmethane

HCID 75576CAS 2467-03-0

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Grundinformationen

Standard-SMILES: Oc1ccc(Cc2ccccc2O)cc1
InChIKey: LVLNPXCISNPHLE-UHFFFAOYSA-N
Summenformel: C13H12O2
Durchschnittliche Molmasse: 200,23 g/mol
Monoisotopische Masse: 200,08372962

Überblick

2,4'-bisphenol f has been reported in Xanthium strumarium with data available.

Namen und Bezeichner

Bevorzugter Name: 2,4'-Dihydroxydiphenylmethane
IUPAC: 2-[(4-hydroxyphenyl)methyl]phenol
Lokaler Name: o-[(4-Hydroxyphenyl)methyl]phenol
Englischer Name: 2,4'-DIHYDROXYDIPHENYLMETHANE
Summenformel: C13H12O2
Molmasse: 200.23

Namen und Synonyme

2,4'-Dihydroxydiphenylmethane2467-03-02,4'-Bisphenol F2,4'-Methylenediphenolo-(p-Hydroxybenzyl)phenolPhenol, 2,4'-methylenedi-LIX5YMK20BNSC-36395ortho, para-bisphenol F(2,4'-dihydroxyphenyl)methaneRefChem:442653219-579-8

Weitere Namen anzeigen

2,4’-bisphenolfo,p-Bisphenol FDihydroxydiphenylmethane(Methylenebisbenzene)-2,4'-diol

2-(4-hydroxybenzyl)phenol2-[(4-hydroxyphenyl)methyl]phenolPhenol, 2-[(4-hydroxyphenyl)methyl]-2,4'-Methylenebis(phenol)(2-Hydroxyphenyl)(4-hydroxyphenyl)methane4-[(2-hydroxyphenyl)methyl]phenolMFCD00060113Phenol, 2-((4-hydroxyphenyl)methyl)-

Datenbank-Bezeichner

CAS: 2467-03-0
PubChem CID: 75576
DTXSID: DTXSID2044890
ChEMBL: CHEMBL3187039
UNII: LIX5YMK20B
EC Number: 219-579-8
Nikkaji: J80.495I

Eigenschaften

Berechnete Struktureigenschaften

XLogP: 3,2
Polarare Oberfläche (TPSA): 40,5 Å²
H-Brücken-Donoren: 2
H-Brücken-Akzeptoren: 2
Frei drehbare Bindungen: 2
Schwere Atome: 15
Formalladung: 0
Komplexität: 185

Experimentelle und physikochemische Eigenschaften

Chemical ClassesBisphenol

Endocrine DisruptorsPotential endocrine disrupting compound

Physikochemische Eigenschaften

Schmelzpunkt: 119 °C · 119 °C
Siedepunkt: 204 · 204-208 °C(Press: 6 Torr)
Dichte: 1.208 · 1.208±0.06 g/cm3(Predicted)
storage temp.: 2 · 2-8°C
Löslichkeit: Acetonitrile (Slightly), DMSO (Slightly)
Aggregatzustand: Solid
pka: 10.15 · 10.15±0.30(Predicted)
Farbe: White to Off-White
Stabilität: Hygroscopic
InChI: 1S/C13H12O2/c14-12-7-5-10(6-8-12)9-11-3-1-2-4-13(11)15/h1-8,14-15H,9H2
InChIKey: LVLNPXCISNPHLE-UHFFFAOYSA-N
SMILES: Oc1ccc(Cc2ccccc2O)cc1
CAS Datenbank: 2467 · 2467-03-0
EPA chemische Informationen: 2 · Phenol, 2-[(4-hydroxyphenyl)methyl]- (2467-03-0)

Sicherheit und Regulatorisches

GHS-Klassifizierung

GHS Classification · 5 Einträge

This chemical does not meet GHS hazard criteria for 2.1% (1 of 47) of reports.

Danger

H317 (83%): May cause an allergic skin reaction [Warning Sensitization, Skin]

P203, P261, P264+P265, P271, P272, P273, P280, P302+P352, P304+P340, P305+P354+P338, P317, P318, P319, P321, P333+P317, P362+P364, P403+P233, P405, and P501 (click each P-code to see the statement)

Aggregated GHS information provided per 47 reports by companies from 5 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.

Gefahrenhinweise

Regulatory Information · 2 Einträge

Phenol, 2-[(4-hydroxyphenyl)methyl]- is listed on the EPA's Chemical Data Reporting (CDR) system. Manufacturers and importers of Phenol, 2-[(4-hydroxyphenyl)methyl]- are required to report information about their production and use of this chemical to the EPA under the Toxic Substances Control Act (TSCA). (40 eCFR Part 711)

Phenol, 2-(4-hydroxyphenyl)methyl-: Does not have an individual approval but may be used under an appropriate group standard

Hazard Classes and CategoriesSkin Sens. 1 (83%)

Sicherheitsdaten

wgk: WGK 3
tsca: TSCA listed
hs_code: 2909500090
risk_code: 36/37/38-62-43-41-37
hazard_code: Xn
safety_code: 26-36/37/39
Speicherklasse: 11 - Combustible Solids
Hazard Classifications: Aquatic Chronic 2Eye Dam. 1Repr. 2Skin Sens. 1

Chemie und Industrie

Verwendung und Herstellung

U.S. Production2023: <50,000 lb

General Manufacturing InformationPhenol, 2-[(4-hydroxyphenyl)methyl]-: ACTIVE

Anwendungen

Beschreibungo-p'-Bisphenol F is allergenic components of phenol-formaldehyde resins resol-type.

Verwenden2,4''-Dihydroxydiphenylmethane can be used in anisotropically conductive paste containing thermosetting compd. and solder particles with improved reliability.