HuagongsheHuagongshe Chemie-Druckbericht · Nur für Forschungszwecke
Bisphenol A diglycidyl ether → Benzene-1,3-diol;ethoxyethane
Beteiligte Stoffe
| Rolle | Name | HCID | Einwaage |
|---|---|---|---|
| Edukt | Bisphenol A diglycidyl ether | HCID 2286 | — |
| Edukt | Methyl Isobutyl Ketone | HCID 7909 | — |
| Edukt | Triphenylphosphine | HCID 11776 | — |
| Produkt | Benzene-1,3-diol;ethoxyethane | HCID 22234841 | — |
Reaktionsbedingungen
| Temperatur | 117 °C |
|---|
Reaktionsschritte
A resorcinol-formaldehyde resin/diglycidyl ether of bisphenol A addition product was prepared in a lab reactor by a procedure comparable to that employed in Example 1. The reactor was charged with about 31.1 g. of a commercial resorcinol-formaldehyde resin, Penacolite B-19-S, (INDSPEC Chemical Corporation, Pittsburgh, Pa., U.S.A.), 125 ml methyl isobutyl ketone and 0.5 g. triphenylphosphine. Then, 90.4 g diglycidyl ether of bisphenol A (Dow epoxy resin DER-331) was added dropwise in about 0.5 hours. The stirred solution was refluxed for about one hour at about 117° C. and devolatilized at reduced pressure to give a dark amber resorcinol ether compound (RE2) having a 72° C. softening point, and having a 0.9 wt. % residual oxirane oxygen.
Herkunft & Nachweise
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|---|
| Patentnummer | US05244725 |
| Quelldatensatz | uspto-grants-1993_09 |
| ORD ID | ord-66975d29552e40698e5e404f59eebdbb |
| Quellennotiz | uspto-grants-1993_09 |