106359-24-4Nc1ccc(Oc2ccc(N)cc2)cc1.O=c1oc(=O)c2cc3c(=O)oc(=O)c3cc12NXDMHKQJWIMEEE-UHFFFAOYSA-NUsesSemi-conductor material. Dielectric component in thin films, high density interconnect systems and multichip modules.
General DescriptionPoly(pyromellitic dianhydride-co-4,4′-oxydianiline), amic acid solution (PAA) converts to polyimide at 300oC. The FTIR spectra indicates a carbonyl stretch of carboxylic acids in PAA at 1650 cm-1. Following the imidization process, the peak at 1720cm-1 grows, indicating the formation of imide group.
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106359-24-4、25038-81-7DTXSID00909988