Bisphenol A diglycidyl ether

HCID 2286CAS 1675-54-3

Basic information

Standard SMILES
CC(C)(c1ccc(OCC2CO2)cc1)c1ccc(OCC2CO2)cc1
InChIKey
LCFVJGUPQDGYKZ-UHFFFAOYSA-N
Molecular formula
C21H24O4
Average molar mass
340.4 g/mol
Monoisotopic mass
340.16745924

Names & identifiers

Preferred name
Bisphenol A diglycidyl ether
IUPAC
2-[[4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane
English name
BISPHENOL A DIGLYCIDYL ETHER RESIN
Molecular formula
C21H24O4
Molecular weight
340.41

Names & synonyms

BISPHENOL A DIGLYCIDYL ETHER1675-54-3BADGE2,2-Bis(4-glycidyloxyphenyl)propaneEpoxide ADiglycidyl bisphenol AEpophen EL 5DGEBADGEBPADian diglycidyl etherDiglycidyl bisphenol A etherDiomethane diglycidyl ether
Show more names
Epon 828der332E-44DER 332 RESINEPON(R) RESIN 828Bisphenol-A epoxy resin E512,2'-(((propane-2,2-diylbis(4,1-phenylene))bis(oxy))bis(Methylene))bis(oxirane)
Bpdgeepi-Rez 5102,2-Bis(4'-glycidyloxyphenyl)propaneDiglycidyl ether of bisphenol A2,2-Bis(p-glycidyloxyphenyl)propaneDiglycidyl diphenylolpropane ether4,4'-Isopropylidenediphenol diglycidyl etherBis(4-glycidyloxyphenyl)dimethylmethane

Database identifiers

CAS
1675-54-3、25085-99-8
PubChem CID
2286
DTXSID
DTXSID6024624
ChEMBL
CHEMBL258558
ChEBI
CHEBI:34578
UNII
F3XRM1NX4H
EC Number
216-823-5
Nikkaji
J14.164J

Properties

Computed structural properties

XLogP
4
Topological polar surface area
43.5 Ų
Hydrogen bond donors
0
Hydrogen bond acceptors
4
Rotatable bonds
8
Heavy atoms
25

Physicochemical properties

Melting point
40 · 40-44 °C
Boiling point
210 °C · 210 °C / 1mmHg
Density
1 · 1,17 g/cm3
vapor pressure
0 Pa · 0Pa at 25℃
refractive index
1.5735 · 1.5735
Flash point
264 · 264-268°

Safety & regulation

Safety data

PPE
Eyeshields, Faceshields, Gloves, type ABEK (EN14387) respirator filter
wgk
1
tsca
TSCA listed
rtecs
TX3800000
hs_code
2910900090
Toxicity
LD50 oral in rabbit: 1980mg/kg

Chemistry & industry

Applications · 6 items

DescriptionMost epoxy resins result from polymerization of bisphenol A diglycidyl ether (BADGE). Delayed hypersensitivity is caused by the low-molecular-weight monomer BADGE (MW 340 g/mol), the dimer having a much lower sensitization power. This allergen caused contact dermatitis in six workers in a plant producing printed circuits boards made of copper sheets and fiberglass fabric impregnated with a brominated epoxy resin. It can also be contained in adhesives.

DescriptionPPARγ is a ligand-activated transcription factor involved in the regulation of lipid homeostasis and may function as a master regulator of adipogenesis. Ligands for PPARγ include antidiabetic drugs of the thiazolidinedione structural class, 15-deoxy-Δ12,14-prostaglandin J2 , and NSAIDS. BADGE is a synthetic compound used in the production of polycarbonate and industrial plastics. This compound was recently identified as an antagonist of PPARγ. BADGE binds to PPARγ with an apparent Kd of 100 μM and interferes with the ability of 3T3-L1 and 3T3-F442A cells to undergo hormone-mediated cell differentiation.

UsesBisphenol A derivative. A PPARγ antagonist; exhibits estrogenic activity; An inhibitor of PPARγ and suppressor of TNFα.

UsesIn the manufacture of epoxy resins and polycarbonates for food packaging.

UsesThe uniqueness of D.E.R. 332 epoxy resin is reflected in its maximum epoxide equivalent weight of 178. Because of its high purity and lack of polymer factions, samples embedded using D.E.R. 322 have uniform performance, exceptionally low viscosity and color; and improved elevated temperature properties.

General DescriptionOdorless yellowish brown liquid. Sinks in water.

Suppliers50 total

梯希爱(上海)化成工业发展有限公司021-67121386 · [email protected]
湖北永阔科技有限公司027-59223108 15972152991 · [email protected]
上海阿拉丁生化科技股份有限公司400-6206333 13167063860 · [email protected]
湖北万得化工有限公司15377098680 15377098680 · [email protected]
武汉欣扬瑞和化学科技有限公司13720274133 · [email protected]

Additional notes

DefinitionChEBI: Bisphenol A diglycidyl ether is a diarylmethane.

Related reactions

52 records

Linked notes

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