Ethoxymethyldiphenylsilane
Basic information
- CAS
1825-59-8- Standard SMILES
CCO[Si](C)(c1ccccc1)c1ccccc1- InChIKey
ADLWTVQIBZEAGJ-UHFFFAOYSA-N- Molecular formula
- C15H18OSi
- Average molar mass
- 242.39 g/mol
- Monoisotopic mass
- 242.11269173
Names & identifiers
- Preferred name
- Ethoxymethyldiphenylsilane
- IUPAC
- ethoxy-methyl-diphenylsilane
- English name
- Diphenylmethylethoxysilane
- Molecular formula
- C15H18OSi
- Molecular weight
- 242.39
Names & synonyms
EthoxymethyldiphenylsilaneEINECS 217-368-5RefChem:592834217-368-5Ethoxy(methyl)diphenylsilane1825-59-8ethoxy-methyl-diphenylsilaneDIPHENYLETHOXYMETHYLSILANEethoxy-methyl-diphenyl-silaneMFCD00026752Diphenyl Methyl EthoxysilaneDiphenyl(methyl)silyloxyethane
Show more names
DK630DK164DiphenylmethylethoxysilaneMETHYLDIPHENYLETHOXYSILANEMethylethoxydiphenylsilanethoxy(methyl)diphenylsilaneBenzene, 1,1'-(ethoxymethylsilylene)bis-[3-phenyl-2-(phenylmethyl)propoxy]silicon
SCHEMBL242577Ethoxy(methyl)di(phenyl)silaneEthoxy(methyl)diphenylsilane #DTXSID70939590AKOS016010453AS-91480SY248696DB-044466
Database identifiers
- CAS
1825-59-8- PubChem CID
- 74576
- DTXSID
DTXSID70939590- EC Number
- 217-368-5
- Nikkaji
- J129.397D
Properties
Computed structural properties
- Topological polar surface area
- 9.2 Ų
- Hydrogen bond donors
- 0
- Hydrogen bond acceptors
- 1
- Rotatable bonds
- 4
- Heavy atoms
- 17
- Formal charge
- 0
- Complexity
- 199
Experimental & physicochemical properties
SpringerMaterials Properties29Si nuclear magnetic resonance spectrum
Physicochemical properties
- Melting point
- -27 °C · -27°C
- Boiling point
- 100 °C · 100 °C
- Density
- 1.018 · 1.018
- refractive index
- 1.544 · 1.544[25°C]
- Flash point
- 165 °C · 165°C
- storage temp.
- Inert atmosphere,Room Temperature
- Specific Gravity
- 1.018 · 1.018
- Hydrolytic Sensitivity
- 7 · 7: reacts slowly with moisture/water
- CAS DataBase Reference
- 1825 · 1825-59-8(CAS DataBase Reference)
- Symbol(GHS)
- 5 · GHS05,GHS06
- Signal word
- Danger
- Hazard statements
- 301 · H301+H311+H331-H314
- Precautionary statements
Safety & regulation
Safety information is for reference only and does not replace the supplier’s Safety Data Sheet (SDS), applicable regulations, or professional assessment.
GHS classification
GHS Classification
Warning
H315 (100%): Causes skin irritation [Warning Skin corrosion/irritation]
P261, P264, P264+P265, P271, P280, P302+P352, P304+P340, P305+P351+P338, P319, P321, P332+P317, P337+P317, P362+P364, P403+P233, P405, and P501 (click each P-code to see the statement)
Aggregated GHS information provided per 39 reports by companies from 2 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.
Hazard information
Hazard Classes and CategoriesSkin Irrit. 2 (100%)
Safety data
- tsca
- Yes
- risk_code
- 36/38-36/37/38
- Signal word
- Danger
- Symbol(GHS)
- GHS05,GHS06
- hazard_code
- Xi
- safety_code
- 3/7-9-26-28-37/39-36
- Hazard statements
- H301+H311+H331-H314
- Precautionary statements
- P501-P260-P270-P271-P264-P280-P361+P364-P303+P361+P353-P301+P330+P331-P301+P310+P330-P304+P340+P310-P305+P351+P338+P310-P403+P233-P405
Chemistry & industry
Applications
UsesDIPHENYLMETHYLETHOXYSILANE is used to synthesize general organosilicon polymers, and can also be used to prepare specific organosilicon compounds, serving as various surface treatment agents, coupling agents, crosslinking agents, etc.
Upstream & downstream products
Upstream raw materials
Downstream products
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Related reactions
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Compound notes
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