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Silicon carbide → Silicon Carbide Silicon Nitride

HRID 2167121
Notes
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Reaction equation

HRID 2167121 reaction equation
[C-:1]#[Si+:2].[N:3]12[Si:8]34[N:9]5[Si:6]61[N:7]3[Si:4]25[N:5]64>>[C-:1]#[Si+:2].[N:3]12[Si:8]34[N:9]5[Si:6]61[N:7]3[Si:4]25[N:5]64
ParticipantsProcedureWorkupSources & evidenceReaction notes

Participants

3

Reactant 2

HCID 9863Silicon carbideHCID 3084099Trisilicon tetranitride

Product 1

HCID 131732902Silicon Carbide Silicon Nitride

Procedure

The solid polymeric thermoset of Example 4 was heated under a flow (110 cc/min) of nitrogen at 3° C./min to 1200° C. and held at this temperature for 1 min followed by heating at 1° C./min to 1415° C. and holding at this temperature for 1 hr and heating at 1° C./min to 1450° C. and holding for 1.5 hr. XRD analysis showed the formation of pure silicon carbide and silicon nitride nanoparticles/nanostructures, which are embedded in an excess amount of silicon. The silicon nitride nanoparticles/nanostructures were formed mainly on the exterior part or outer surface of the sample, which was exposed to the nitrogen. The silicon carbide nanoparticles/nanostructures were mainly formed on the interior portion of the sample.

Workup

  1. temperatureThe solid polymeric thermoset of Example 4 was heated under a flow (110 cc/min) of nitrogen at 3° C./min to 1200° C.
  • temperatureby heating at 1° C./min to 1415° C.
  • waitholding at this temperature for 1 hr
  • temperatureheating at 1° C./min to 1450° C.
  • waitholding for 1.5 hr
  • Sources & evidence

    ORD record
    ord-dd84094ab1b94b32b7ea0b4eb671237e
    Source dataset
    uspto-grants-2015_06
    DOI
    10.6084/m9.figshare.5104873.v1
    Patent number
    US09045374B2

    Reaction notes

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    On this pageParticipantsProcedureWorkupSources & evidenceReaction notes