ポリイミド

用途をもつポリマー．とくに芳香族のポリイミドは耐熱性の要求されるフィルム，プリント基板，電線エナメルなどに使用される．代表的なものは，無水ピロメリト酸と芳香族ジアミンとの反応によるもので，短時間なら500 ℃ の高温に耐える．

使用Polyimides (PI, also known by alternative brand names: Pyralin Apical, Kapton, and Kaptrex) are polymers made of imide monomers (two carbonyl groups bonded to nitrogen). It has a density of 1430 kg/m3, Young’s modulus 3200 MPa, tensile strength (75–90) MPa, glass transition temperature > 400℃, thermal conductivity of 0.53 W/(m K), and a low relative dielectric constant of 2.9. Polyimides have applications similar to BCBs and also find applications as a low dielectric constant material in high-frequency interconnects (low-k material). The higher thermal conductivity and high glass transition temperature when compared to other types of insulating polymers also makes them a good choice where heat dissipation is important or other applications requiring good thermal management or low parasitic capacitances. Microchannels and high-frequency microdevices embedded in both photosensitive and nonphotosensitive polyimides have been fabricated and reported.