戻る
化工社化工社 化学情報印刷レポート · 研究参考用
HRID 1655833作成日:2026年10月26日

Trisilicon tetranitride → Ammonia

https://huagongshe.com/reaction/1655833

反応式

関与物質

役割名称HCID仕込み量
反応物Trisilicon tetranitrideHCID 3084099—
反応物OximinosilaneHCID 6336883—
生成物AmmoniaHCID 222—
生成物SilaneHCID 23953—
生成物Trisilicon tetranitrideHCID 3084099—

反応手順

Alternatively, the silicon-rich barrier layer 23 can be silicon nitride or silicon oxynitride with a high refractive index. The determining and guiding physical characteristic is again the refractive index wherein the critical and preferred range for silicon nitride is between about 1.9 to 2.1 and for silicon oxynitride is between about 1.5 to 2.1. The silicon nitride layer is formed by the silane process under the typical conditions of power of 380 watts, pressure of 4.8 Torr, space of 480 mils, temperature of 400° C., silane flow of 130 ccm, ammonia flow of 55 ccm and nitrogen flow of 2000 to 4000 ccm. The silicon oxynitride layer is formed by the silane process under the typical conditions of power of 340 watts, pressure of 5 Torr, space of 410 mils, temperature of 400° C., silane flow of 75 ccm, ammonia flow of 50 ccm, nitrogen flow of 3500 to 4500 ccm, and dinitrogen oxide (N2O) flow of 75 ccm.

情報源と証拠

DOI10.6084/m9.figshare.5104873.v1
特許番号US05252515
出典データセットuspto-grants-1993_10
ORD IDord-dffd243faa71433a912408d5a8282039
出典メモuspto-grants-1993_10