関与物質
| 役割 | 名称 | HCID | 仕込み量 |
|---|
| 反応物 | Hydrogen Peroxide | HCID 784 | — |
| 反応物 | Sulfuric Acid | HCID 1118 | — |
| 反応物 | Titanium silicide (TiSi2) | HCID 6336889 | — |
| 反応物 | Azane;hydrate | HCID 12896473 | — |
| 生成物 | Hydrogen Peroxide | HCID 784 | — |
| 生成物 | Sulfuric Acid | HCID 1118 | — |
| 生成物 | Titanium mononitride | HCID 93091 | — |
反応手順
In this embodiment, the first wet etching is performed using a mixed solution of the composition of H2SO4 :H2O2 =5:1 at an etchant temperature of 140° C. for 20 minutes. The amount of the titanium disilicide film of the C49 structure etched off during the first etching by this mixed solution is extremely less than the amount of the titanium disilicide film of the C49 structure etched off during the first etching by the mixed solution of ammonia water and hydrogen peroxide (under this condition, about 1 nm of the film is etched off) (FIG. 5). During the first etching by the mixed solution of sulfuric acid and hydrogen peroxide, the titanium nitride film formed during the first rapid thermal annealing is removed in about 10 minutes. In this embodiment, therefore, the first wet etching is performed for 20 minutes including margin. Since the first wet etching is performed at 140° C., the maintenance of the composition of the mixed solution is required. During the first wet etching, the titanium-excess titanium silicide (Ti5 Si3) film is only little removed. In this embodiment, therefore, the second wet etching is performed using the mixed solution having a composition of NH4OH:H2O2 :H2O=1:1:5 at room temperature for 30 minutes.
情報源と証拠
| DOI | 10.6084/m9.figshare.5104873.v1 |
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| 特許番号 | US05776822 |
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| 出典データセット | uspto-grants-1998_07 |
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| ORD ID | ord-a3f0cbb786c64e44890566b6e9c43165 |
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| 出典メモ | uspto-grants-1998_07 |
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