이량체,파릴렌F

개요Parylene F Dimer is the solid, granular starting material used to produce parylene conformal coating films. Parylene F brings allows for parylene performance at higher operating temperatures, along with similar barrier and dielectric protection of other parylene types.

용도Parylene type materials have been widely used in electronic products, Parylene family of commercially valuable types of materials are divided into four types, respectively, Parylene N, Parylene C, Parylene F, Parylene Ht.Parylene is applied with a vapor deposition process performed in a customized vacuum system. There is no curing involved. Typical coating thickness ranges from 2-50 microns.Barrier layer protection for high temperature applications.Protects devices from moisture, bodily fluids, corrosive gases, vapors, liquids and other contamination.Waterproof electronics up to IPX8 protection level and meet requirements for IPC, MIL specs and NASA standards.Prevents corrosion of printed circuit boards and electronic components.Dielectric layer to protect electronics from shorts and arcing.Thin film encapsulation is used to protect electronics from vibration or shock.Tin whisker mitigation