Succinic Acid → Epoxysuccinic acid

HRID 1447977

반응식

HRID 1447977 반응식
[C:1]([OH:8])(=[O:7])[CH2:2][CH2:3][C:4]([OH:6])=[O:5].C(N(CCCC)CCCC)CCC.C(C(C)=[O:25])C>>[O:25]1[CH:2]([C:1]([OH:8])=[O:7])[CH:3]1[C:4]([OH:6])=[O:5]

참가 물질

4

반응물 3

HCID 1110Succinic AcidHCID 6569Methyl Ethyl KetoneHCID 7622Tributylamine

생성물 1

HCID 86022Epoxysuccinic acid

반응 조건

온도
150 °C

실험 절차

A reaction vessel was charged with 442 parts Epoxy B, 442 parts Epoxy E, 116.0 parts succinic acid, 110 parts methyl ethyl ketone, and 3 parts tri-n-butylamine (catalyst). The temperature was raised to 150° C., while removing sufficient MEK (100 parts) to maintain controlled reflux at this temperature. The reaction maintained at 150° C., for 1.5 l hours and then poured into a poly(tetrafluoroethylene) lined tray and allowed to cool to ambient temperature. The resulting solid resin had an acid number of 32.0 and an epoxy content of 0.03 meq./g.

후처리

  1. customwhile removing sufficient MEK (100 parts)
  2. temperatureto maintain
  3. temperaturecontrolled reflux at this temperature
  4. temperatureThe reaction maintained at 150° C., for 1.5 l hours
  5. additionpoured into a poly(tetrafluoroethylene) lined tray
  6. temperatureto cool to ambient temperature

출처 및 근거

ORD 기록
ord-448d8dff98184a3088c411fe06c20c69
출처 데이터셋
uspto-grants-1979_12
특허 번호
US04179440

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