Huagongshe화공사 화학 정보 인쇄 보고서 · 연구 참고용
Silicon carbide → Silicon Carbide Silicon Nitride
참여 물질
| 역할 | 이름 | HCID | 투입량 |
|---|---|---|---|
| 반응물 | Silicon carbide | HCID 9863 | — |
| 반응물 | Trisilicon tetranitride | HCID 3084099 | — |
| 생성물 | Silicon Carbide Silicon Nitride | HCID 131732902 | — |
반응 단계
The solid polymeric thermoset of Example 4 was heated under a flow (110 cc/min) of nitrogen at 3° C./min to 1200° C. and held at this temperature for 1 min followed by heating at 1° C./min to 1415° C. and holding at this temperature for 1 hr and heating at 1° C./min to 1450° C. and holding for 1.5 hr. XRD analysis showed the formation of pure silicon carbide and silicon nitride nanoparticles/nanostructures, which are embedded in an excess amount of silicon. The silicon nitride nanoparticles/nanostructures were formed mainly on the exterior part or outer surface of the sample, which was exposed to the nitrogen. The silicon carbide nanoparticles/nanostructures were mainly formed on the interior portion of the sample.
출처 및 근거
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|---|
| 특허 번호 | US09045374B2 |
| 출처 데이터셋 | uspto-grants-2015_06 |
| ORD ID | ord-dd84094ab1b94b32b7ea0b4eb671237e |
| 출처 메모 | uspto-grants-2015_06 |