Dimethylformamide → HCID 59093767, 화합물

HRID 2181604노트

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HRID 2181604 반응식
[Li+].CC([N-]C(C)C)C.[CH2:9]1[CH2:13][O:12][CH2:11][CH2:10]1.[Se:14]1[CH:18]=[CH:17][CH:16]=[C:15]1[C:19]1[Se:20][C:21]([C:24]2[Se:25]C=CC=2)=[CH:22][CH:23]=1.CN(C=O)C>C(OCC)(=O)C>[CH:11]([C:10]1[Se:25][C:24]([C:21]2[Se:20][C:19]([C:15]3[Se:14][CH:18]=[CH:17][CH:16]=3)=[CH:23][CH:22]=2)=[CH:13][CH:9]=1)=[O:12]

참가 물질

6

반응물 4

HCID 6228DimethylformamideHCID 8028TetrahydrofuranHCID 2724682Lithium diisopropylamideHCID 599441801~2~,2~2~:2~5~,3~2~-Terselenophene

생성물 1

HCID 59093767HCID 59093767, 화합물수율 75%

시약·촉매·용매 1

HCID 8857Ethyl Acetate용매

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온도
-78 °C

실험 절차

LDA (1.0 M solution in THF, 310 mL) was added to an anhydrous THF solution (4 mL) containing 2,2′:5′,2″-terselenophene (100 mg) under N2 at −78° C. The solution was stirred at −78° C. for 3 h, anhydrous DMF (1 mL) was added, stirred at −78° C. for 1 h, and slowly warmed to room temperature. The reaction solution was diluted with ethyl acetate (100 mL) and washed with H2O (4×100 mL). The organic layer was separated, dried over MgSO4, filtered, and the solvent was removed under vacuum. The residue was chromatographed over silica gel using CH2Cl2 to afford 2-formyl-5,2′:5′,2″-terselenophene in 75% yield.

후처리

  1. stirringstirred at −78° C. for 1 h
  2. temperatureslowly warmed to room temperature
  3. washwashed with H2O (4×100 mL)
  4. customThe organic layer was separated
  5. dry with materialdried over MgSO4
  6. filtrationfiltered
  7. customthe solvent was removed under vacuum
  8. customThe residue was chromatographed over silica gel

출처 및 근거

ORD 기록
ord-b07f14f91eec499f965bda2fbb12caea
출처 데이터셋
uspto-grants-2005_05
특허 번호
US06894039B2

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