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Huagongshe화공사 화학 정보 인쇄 보고서 · 연구 참고용
HRID 2231979생성일: 2026년 10월 26일

Citric Acid → Nickel indium bismuth sulfate

https://huagongshe.com/reaction/2231979

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참여 물질

역할이름HCID투입량
반응물Citric AcidHCID 311—
반응물Sulfate IonHCID 1117—
반응물Sulfamic AcidHCID 5987—
반응물Nickel carbonateHCID 18746—
반응물Nickel DichlorideHCID 24385—
반응물Nickel SulfateHCID 24586—
반응물Sulfamate ionHCID 177700—
반응물Sodium bismuthateHCID 4063671—
반응물IndiumHCID 5359967—
반응물Dichloronickel;hexahydrateHCID 11791229—
용매Hydrochloric AcidHCID 313—
용매WaterHCID 962—
생성물Nickel indium bismuth sulfateHCID 131715775—
생성물Indium bismuth sulfamateHCID 131715776—

반응 조건

온도45 °C

반응 단계

The nickel/indium/bismuth sulfate and inckel/indium/bismuth sulfamate plating baths were prepared similarly. Preparation of one liter of the sulfate and sulfamate formulations is outlined below. Citric acid (57 grams) is dissolved in 300 ml of deionized water heated to 45° C. Nickel carbonate (45 grams) is then dissolved in the solution. The pH of the bath at this point should be about 4.0. Nickel chloride (15 or 75 grams/liter of nickel chloride hexahydrate for the sulfate and sulfamate plating baths, respectively) and nickel sulfate (300 grams/liter of nickel sulfate hexahydrate or 350 grams/liter of nickel sulfamate hexahydrate) are then added. The solution is brought up to a volume of 1L by addition of deionized water and the pH of the bath is adjusted to 3.2 either with nickel carbonate or sulfuric/sulfamic acid. Indium metal is then added electrochemically. Indium metal (either strips or shot in an anode basket) is dissolved anodically at about 5 amps/dm2. The cathode current density should be greater than about 50 amps/dm2. Current is applied until the indium reaches the desired concentration, e.g. 2.5 grams/liter for the sulfate formulation and 5 grams/liter for the sulfamate bath. Bismuth in solution form is then added. Bismuth is added as an HCl solution prepared by dissolving sodium bismuthate in 20% HCl, precipitating a white solid by the addition of water, filtering and redissolving the solid in 20% HCl. The bismuth concentration is varied from 0.1-3.0 g/L metal in the sulfate system and from 0.2-2.0 g/L metal in the sulfamate system. The base formulation for the sulfate based Ni/In/Bismuth alloy electroplating bath is set forth the following Table I.

출처 및 근거

DOI10.6084/m9.figshare.5104873.v1
특허 번호US04785137
출처 데이터셋uspto-grants-1988_11
ORD IDord-6b9903181b934df78f11f46783f815fc
출처 메모uspto-grants-1988_11