Huagongshe화공사 화학 정보 인쇄 보고서 · 연구 참고용
Vinyl Acetate → Sec-Butyl acetate
참여 물질
| 역할 | 이름 | HCID | 투입량 |
|---|---|---|---|
| 반응물 | Vinyl Acetate | HCID 7904 | — |
| 반응물 | Phenol--water (1/1) | HCID 18417210 | — |
| 생성물 | Sec-Butyl acetate | HCID 7758 | — |
| 생성물 | Vinyl Acetate | HCID 7904 | — |
반응 단계
Using for layer (C) this adhesive composition, and as layer (A) saponified ethylene-vinyl acetate copolymer resin containing 56 mol % of vinyl acetate component, and having [η]=0.96 (in the mixture of phenol/water=85/15, at 30° C., dl/g), which was obtained by saponifying 99.5 mol % of vinyl acetate and as layer (B) poly vinyl acetate resin plasticized with 35 wt % of dioctylphthalate, co-extrusion was carried out at a die temperature of 200° C. to obtain a fine laminated article having five layers of three kinds of resin, (B)/(C)/(A)/(C)/(B). The each thickness of layers was 10 μm for (A), 100 μm for (B) and 5 μm for (C). And the article had a good peel strength of (A)/(B); 1.0 kg/cm (T peel test at 200 mm/min).
출처 및 근거
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|---|
| 특허 번호 | US04719153 |
| 출처 데이터셋 | uspto-grants-1988_01 |
| ORD ID | ord-3ef3f5b57bc74020b4c509c8694e62ed |
| 출처 메모 | uspto-grants-1988_01 |