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Huagongshe화공사 화학 정보 인쇄 보고서 · 연구 참고용
HRID 2413625생성일: 2026년 10월 24일

Vinyl Acetate → Sec-Butyl acetate

https://huagongshe.com/ko/reaction/2413625

반응식

참여 물질

역할이름HCID투입량
반응물Vinyl AcetateHCID 7904—
반응물Phenol--water (1/1)HCID 18417210—
생성물Sec-Butyl acetateHCID 7758—
생성물Vinyl AcetateHCID 7904—

반응 단계

Using for layer (C) this adhesive composition, and as layer (A) saponified ethylene-vinyl acetate copolymer resin containing 56 mol % of vinyl acetate component, and having [η]=0.96 (in the mixture of phenol/water=85/15, at 30° C., dl/g), which was obtained by saponifying 99.5 mol % of vinyl acetate and as layer (B) poly vinyl acetate resin plasticized with 35 wt % of dioctylphthalate, co-extrusion was carried out at a die temperature of 200° C. to obtain a fine laminated article having five layers of three kinds of resin, (B)/(C)/(A)/(C)/(B). The each thickness of layers was 10 μm for (A), 100 μm for (B) and 5 μm for (C). And the article had a good peel strength of (A)/(B); 1.0 kg/cm (T peel test at 200 mm/min).

출처 및 근거

DOI10.6084/m9.figshare.5104873.v1
특허 번호US04719153
출처 데이터셋uspto-grants-1988_01
ORD IDord-3ef3f5b57bc74020b4c509c8694e62ed
출처 메모uspto-grants-1988_01