Huagongshe화공사 화학 정보 인쇄 보고서 · 연구 참고용
HRID 342378생성일: 2026년 10월 26일
Benzenamine, 4,4'-[1,3-phenylenebis(oxy)]bis- → 5,5'-Carbonyldi(2-benzofuran-1,3-dione)--1-(4-aminophenyl)-1,3,3-trimethyl-2,3-dihydro-1H-inden-5-amine (1/1)
https://huagongshe.com/reaction/342378
참여 물질
| 역할 | 이름 | HCID | 투입량 |
|---|
| 반응물 | Benzenamine, 4,4'-[1,3-phenylenebis(oxy)]bis- | HCID 17201 | — |
| 반응물 | (1,1'-Biphenyl)-4,4'-diamine, 2,2'-bis(trifluoromethyl)- | HCID 629349 | — |
| 반응물 | Bis(aminopropyl)tetramethyldisiloxane | HCID 21585087 | — |
| 반응물 | Diphthalic dianhydride | HCID 57275479 | — |
| 반응물 | 2,2-Bis(3,4-dicarboxyphenyl)hexafluoropropane dihydride | HCID 87853307 | — |
| 용매 | N-methyl-2-pyrrolidone | HCID 13387 | — |
| 생성물 | 5,5'-Carbonyldi(2-benzofuran-1,3-dione)--1-(4-aminophenyl)-1,3,3-trimethyl-2,3-dihydro-1H-inden-5-amine (1/1) | HCID 6454485 | — |
반응 단계
In 11.81 kg of N-methyl-2-pyrrolidone were dissolved 0.94 kg (3.25 mols) of 1,3-bis(4-aminophenoxy)benzene, 0.936 kg (2.92 mols) of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, and 0.081 kg (0.33 mol) of bis(aminopropyl)tetramethyldisiloxane (the sum of the diamine components: 6.50 mols) as diamines and 0.764 kg (2.60 mols) of diphathalic acid dianhydride and 1,732 kg (3.90 mols) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dihydride (the sum of the tetracarboxylic acid dianhydride components: 6.50 mols) as aromatic tetracarboxylic acid dianhydrides. The resulting solution was stirred at room temperature for 24 hours. The temperature of the solution was raised to 75° C., and when the viscosity reached 5,000 c.p., heating was stopped, and the solution was allowed to stand to cool it to room temperature. By adding 0.696 kg (1.93 mols) of an N-methyl compound to the solution, a solution of a photosensitive polyimide resin precursor was prepared. After coating the solution of the photosensitive polyimide resin precursor obtained above on a long stainless steel (SUS 304) foil having a thickness of 25 μm by a continuous cater, the coating layer was dried by heating at 120° C. for 2 minutes to form the coating layer of the photosensitive polyimide resin precursor.
출처 및 근거
| DOI | 10.6084/m9.figshare.5104873.v1 |
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| 특허 번호 | US05858518 |
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| 출처 데이터셋 | uspto-grants-1999_01 |
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| ORD ID | ord-51d0227ad7b54479821be8b91ef6ad7e |
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| 출처 메모 | uspto-grants-1999_01 |
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