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Huagongshe화공사 화학 정보 인쇄 보고서 · 연구 참고용
HRID 993482생성일: 2026년 10월 25일

Triphenylphosphine → HCID 178431455, 화합물

https://huagongshe.com/reaction/993482

반응식

참여 물질

역할이름HCID투입량
반응물TriphenylphosphineHCID 11776—
반응물DiisopropylcarbodiimideHCID 12734—
반응물1-HydroxybenzotriazoleHCID 75771—
반응물2,4-Dichlorophenethyl alcoholHCID 2734099—
반응물3,5-Dihydroxy-4-methylbenzoic AcidHCID 2748045—
반응물Diisopropyl azodicarboxylateHCID 5363146—
반응물BistrimethylsilylacetamidHCID 11708267—
반응물HCID 178454311HCID 178454311—
용매DimethylformamideHCID 6228—
용매TetrahydrofuranHCID 8028—
생성물HCID 178431455HCID 178431455—

반응 단계

Rink resin (239 mg; loading 0.43 mmol/g) functionalized with Arg(Boc)2 was coupled with 106 mg of 3,5-dihydroxy-4-methylbenzoic acid in the presence of DIC (85 mg) and HOBt (90 mg) in DMF (1.5 ml). The resin was then washed and treated with a 15% solution of benzyltrimethylammonium hydroxide in DMF for 45 min. The resin was washed with DMF, 10% acetic acid in DMF, DMF and DCM and dried in vacuo for 4 h. The dried resin was washed with anhydrous THF and mixed with 145 mg (0.5 mmole) of triphenylphosphane and 25 μl of bistrimethylsilylacetamide in THF and kept at room temperature for 1 h. In a separate vial a mixture of 100 mg (0.2 mmol) of 2-(2,4-dichlorophenyl)ethanol and 100 μl of DIAD in dry THF was prepared. The reaction mixture was added to the resin which had previously been cooled in a refrigerator for 10 min. Coupling was continued at room temperature overnight. The resin was washed and dried, and the final product was cleaved off and processed as described in Example 1.

출처 및 근거

DOI10.6084/m9.figshare.5104873.v1
특허 번호US06472562B1
출처 데이터셋uspto-grants-2002_10
ORD IDord-07d2bdb2d09140029947298213553af4
출처 메모uspto-grants-2002_10