HuagongsheHuagongshe Chemistry Print Report · For research reference only
Dimethylformamide → HCID 11520444, compound
Participants
| Role | Name | HCID | Charge |
|---|---|---|---|
| Reactant | Dimethylformamide | HCID 6228 | — |
| Reactant | Triethylamine | HCID 8471 | — |
| Reactant | Phenylacetylene | HCID 10821 | — |
| Reactant | HCID 11513133 | HCID 11513133 | — |
| Catalyst | Copper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI) | HCID 24350 | — |
| Catalyst | HCID 178418476 | HCID 178418476 | — |
| Solvent | Formic Acid | HCID 284 | — |
| Solvent | Acetonitrile | HCID 6342 | — |
| Product | HCID 11520444 | HCID 11520444 | 22.3% |
Reaction Steps
Compound 36 was prepared according to Method D, using compound 19 (88.4 mg, 0.130 mmol), phenylacetylene (0.0285 mL, 0.260 mmol), Et3N (0.181 mL, 1.30 mmol), Pd(PPh3)2Cl2 (4.49 mg, 0.0064 mmol), CuI (2.46 mg, 0.0129 mmol) and DMF (2.1 mL). RP-LC-MS (35 min gradient of 40-100% CH3CN in 0.05% aqueous formic acid) afforded the title compound (20.4 mg, 22%) as a white solid.
Provenance & Evidence
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|---|
| Patent number | US07807677B2 |
| Source dataset | uspto-grants-2010_10 |
| ORD ID | ord-167a656b5af6420b97a9acd3e5edae1a |
| Source note | uspto-grants-2010_10 |