HuagongsheHuagongshe Chemistry Print Report · For research reference only
Dimethylformamide → HCID 11672070, compound
Participants
| Role | Name | HCID | Charge |
|---|---|---|---|
| Reactant | Dimethylformamide | HCID 6228 | — |
| Reactant | Triethylamine | HCID 8471 | — |
| Reactant | 3-Ethynylpyridine | HCID 186003 | — |
| Reactant | HCID 11513133 | HCID 11513133 | — |
| Catalyst | Copper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI) | HCID 24350 | — |
| Catalyst | HCID 178418476 | HCID 178418476 | — |
| Solvent | Formic Acid | HCID 284 | — |
| Solvent | Acetonitrile | HCID 6342 | — |
| Product | HCID 11672070 | HCID 11672070 | 45.4% |
Reaction Steps
Compound 38 was prepared according to Method D, using compound 19 (85.8 mg, 0.126 mmol), 3-(ethynyl)pyridine (0.0260 mL, 0.252 mmol), Et3N (0.176 mL, 1.26 mmol), Pd(PPh3)2Cl2 (4.42 mg, 0.0063 mmol), CuI (2.40 mg, 0.0126 mmol) and DMF (2.1 mL). RP-LC-MS (35 min gradient of 25-100% CH3CN in 0.05% aqueous formic acid) afforded the title compound (40.3 mg, 45%) as a white solid.
Provenance & Evidence
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|---|
| Patent number | US07807677B2 |
| Source dataset | uspto-grants-2010_10 |
| ORD ID | ord-99f3618036b14dfb98eef936d22debd0 |
| Source note | uspto-grants-2010_10 |