Participants
| Role | Name | HCID | Charge |
|---|
| Reactant | M-Phenylenediamine | HCID 7935 | — |
| Reactant | Isophthalic Acid | HCID 8496 | — |
| Reactant | Pentamethylbenzene | HCID 12784 | — |
| Reactant | N-methyl-2-pyrrolidone | HCID 13387 | — |
| Reactant | HCID 21870694 | HCID 21870694 | — |
| Product | Terephthalic Acid | HCID 7489 | — |
| Product | P-Phenylenediamine | HCID 7814 | — |
Reaction Steps
Next, various aromatic dicarboxyic acids (4 mmol), various aromatic diamines (4 mmol), pentamethylbenzene (4 g), N-methylpyrrolidinone (NMP) (1 g), and 3,4,5-trifluorophenylboric acid (0.04 mmol) were poured into a Schlenk and stirred at 200° C. (temperature of oil bath) for one day. The other conditions were the same as in Example 2. When m-phenylenediamine and isophthalic acid were polycondensed as in chemical formula 2, the isolation yield of nomex was 99% or more. As to the isolation yield of keylar, the same result was obtained for a case of chemical formula 3, where p-phenylenediamine and terephthalic acid were polycondensed. The isolation yield of nomex was 97% for a case of chemical formula 4, where diaminodiphenylether and isophthatic acid were polycondensed. The isolation yield of tellurone was 42% for a case of chemical formula 5, where p-aminobenzoic acid was polycondensed.
Provenance & Evidence
| DOI | 10.6084/m9.figshare.5104873.v1 |
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| Patent number | US06586555B1 |
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| Source dataset | uspto-grants-2003_07 |
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| ORD ID | ord-bdb86a194e7748fca70f80e83e401b10 |
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| Source note | uspto-grants-2003_07 |
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