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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 1356482Generated: November 1, 2026

M-Phenylenediamine → Terephthalic Acid

https://huagongshe.com/reaction/1356482

Reaction equation

Participants

RoleNameHCIDCharge
ReactantM-PhenylenediamineHCID 7935—
ReactantIsophthalic AcidHCID 8496—
ReactantPentamethylbenzeneHCID 12784—
ReactantN-methyl-2-pyrrolidoneHCID 13387—
ReactantHCID 21870694HCID 21870694—
ProductTerephthalic AcidHCID 7489—
ProductP-PhenylenediamineHCID 7814—

Reaction Conditions

Temperature200 °C

Reaction Steps

Next, various aromatic dicarboxyic acids (4 mmol), various aromatic diamines (4 mmol), pentamethylbenzene (4 g), N-methylpyrrolidinone (NMP) (1 g), and 3,4,5-trifluorophenylboric acid (0.04 mmol) were poured into a Schlenk and stirred at 200° C. (temperature of oil bath) for one day. The other conditions were the same as in Example 2. When m-phenylenediamine and isophthalic acid were polycondensed as in chemical formula 2, the isolation yield of nomex was 99% or more. As to the isolation yield of keylar, the same result was obtained for a case of chemical formula 3, where p-phenylenediamine and terephthalic acid were polycondensed. The isolation yield of nomex was 97% for a case of chemical formula 4, where diaminodiphenylether and isophthatic acid were polycondensed. The isolation yield of tellurone was 42% for a case of chemical formula 5, where p-aminobenzoic acid was polycondensed.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS06586555B1
Source datasetuspto-grants-2003_07
ORD IDord-bdb86a194e7748fca70f80e83e401b10
Source noteuspto-grants-2003_07