関与物質
| 役割 | 名称 | HCID | 仕込み量 |
|---|
| 反応物 | Succinic Acid | HCID 1110 | — |
| 反応物 | Methyl Ethyl Ketone | HCID 6569 | — |
| 反応物 | Tributylamine | HCID 7622 | — |
| 生成物 | Epoxysuccinic acid | HCID 86022 | — |
反応手順
A reaction vessel was charged with 442 parts Epoxy B, 442 parts Epoxy E, 116.0 parts succinic acid, 110 parts methyl ethyl ketone, and 3 parts tri-n-butylamine (catalyst). The temperature was raised to 150° C., while removing sufficient MEK (100 parts) to maintain controlled reflux at this temperature. The reaction maintained at 150° C., for 1.5 l hours and then poured into a poly(tetrafluoroethylene) lined tray and allowed to cool to ambient temperature. The resulting solid resin had an acid number of 32.0 and an epoxy content of 0.03 meq./g.
情報源と証拠
| DOI | 10.6084/m9.figshare.5104873.v1 |
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| 特許番号 | US04179440 |
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| 出典データセット | uspto-grants-1979_12 |
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| ORD ID | ord-448d8dff98184a3088c411fe06c20c69 |
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| 出典メモ | uspto-grants-1979_12 |
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