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HRID 1447977作成日:2026年10月25日

Succinic Acid → Epoxysuccinic acid

https://huagongshe.com/reaction/1447977

反応式

関与物質

役割名称HCID仕込み量
反応物Succinic AcidHCID 1110—
反応物Methyl Ethyl KetoneHCID 6569—
反応物TributylamineHCID 7622—
生成物Epoxysuccinic acidHCID 86022—

反応条件

温度150 °C

反応手順

A reaction vessel was charged with 442 parts Epoxy B, 442 parts Epoxy E, 116.0 parts succinic acid, 110 parts methyl ethyl ketone, and 3 parts tri-n-butylamine (catalyst). The temperature was raised to 150° C., while removing sufficient MEK (100 parts) to maintain controlled reflux at this temperature. The reaction maintained at 150° C., for 1.5 l hours and then poured into a poly(tetrafluoroethylene) lined tray and allowed to cool to ambient temperature. The resulting solid resin had an acid number of 32.0 and an epoxy content of 0.03 meq./g.

情報源と証拠

DOI10.6084/m9.figshare.5104873.v1
特許番号US04179440
出典データセットuspto-grants-1979_12
ORD IDord-448d8dff98184a3088c411fe06c20c69
出典メモuspto-grants-1979_12