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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 1803826Generated: November 2, 2026

Diisopropylethylamine → HCID 86630209, compound

https://huagongshe.com/reaction/1803826

Reaction equation

Participants

RoleNameHCIDCharge
ReactantDiisopropylethylamineHCID 81531—
ReactantHCID 59552483HCID 59552483—
ReactantHCID 59621025HCID 59621025—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
SolventTetrahydrofuranHCID 8028—
ProductHCID 86630209HCID 86630209—

Reaction Conditions

Temperature23 °C

Reaction Steps

To a stirring solution of N-(bis(4-methoxyphenyl)(phenyl)methyl)-6-(prop-2-ynyloxy)benzo[d]thiazole-2-sulfonamide (83 mg, 0.145 mmol) and the Boc-protected amide 151 (107 mg, 0.145 mmol) in THF (0.7 mL) was added copper(I) iodide (3 mg, 0.0145 mmol) then diisopropylethylamine (28 μL, 0.16 mmol). The mixture was allowed to stir for 2 h at 23° C. then concentrated in vacuo and the crude residue purified by flash chromatgraphy on silica gel using hexanes/ethyl actetate on a Biotage purification system yielding the desired product as a yellow, crystalline solid (145 mg, 82%).

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS08354092B2
Source datasetuspto-grants-2013_01
ORD IDord-cd5ea910c9404e15a4a601669386a99e
Source noteuspto-grants-2013_01