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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 1824951Generated: November 1, 2026

HCID 22144789, compound → HCID 22144785, compound

https://huagongshe.com/reaction/1824951

Reaction equation

Participants

RoleNameHCIDCharge
ReactantHCID 22144789HCID 22144789—
ReactantHCID 178418546HCID 178418546—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
SolventDimethylformamideHCID 6228—
ProductHCID 22144785HCID 221447856%

Reaction Conditions

Temperature120 °C

Reaction Steps

A mixture of 0.20 gm (0.54 mMol) N-tert-butoxycarbonyl 1-(3-bromo-5-fluorobenzofur-7-yl)-2-aminopropane, 0.95 gm (5 mMol) copper(I) iodide, and 0.43 gm (4.78 mMol) copper(I) cyanide in 10 mL dimethylformamide was purged with nitrogen for 15 minutes. The mixture was then heated at 120° C. An additional equivalent of copper(I) iodide and copper(I) cyanide were added and the reaction continued at 120° C. for about 16 hours. After cooling to room temperature the reaction mixture was diluted with dichloromethane and then silica gel was added. The solvents were removed under reduced pressure and the dry silica gel remaining was loaded on the top of a silica gel column. The column was then eluted with a gradient of hexane containing from 17% to 20% ethyl acetate. Fractions containing product were combined and concentrated under reduced pressure to provide 0.010 gm (6%) of the desired compound.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS07045545B1
Source datasetuspto-grants-2006_05
ORD IDord-c130a381e2db4c56b0eccc9cc4380b42
Source noteuspto-grants-2006_05