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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 1916518Generated: November 1, 2026

Diisopropylamine → HCID 67364555, compound

https://huagongshe.com/reaction/1916518

Reaction equation

Participants

RoleNameHCIDCharge
ReactantDiisopropylamineHCID 7912—
Reactant2,5-DibromopyridineHCID 69353—
ReactantDiisopropylethylamineHCID 81531—
ReactantHCID 85969792HCID 85969792—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
SolventDimethylformamideHCID 6228—
ProductHCID 67364555HCID 67364555—

Reaction Conditions

Temperature100 °C

Reaction Steps

A mixture of 500 mg (2.30 mmol) diethyl-[2-(4-ethynyl-phenoxy)-ethyl]-amine, 545 mg (2.30 mmol) 2,5-dibromopyridine, 161 mg (0.23 mmol) tetrakis-triphenylphosphane-palladium, 13 mg (0.07 mmol) CuI, 2 mL ethyldiisopropylamine and 2 mL diisopropylamine in 50 mL DMF is heated for 20 h at 100° C. under a nitrogen atmosphere. The solvent is distilled off i.vac., the residue is taken up in water, exhaustively extracted with EtOAc and dried over Na2SO4. After the desiccant and solvent have been eliminated the residue is purified on silica gel (EtOAc/MeOH/NH3 95:5:0.5).

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS08618132B2
Source datasetuspto-grants-2013_12
ORD IDord-9685b56a81e242d09a0278154741cefb
Source noteuspto-grants-2013_12