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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 1955569Generated: October 27, 2026

Hydrogen Peroxide → Hydrogen Peroxide

https://huagongshe.com/reaction/1955569

Reaction equation

Participants

RoleNameHCIDCharge
ReactantHydrogen PeroxideHCID 784—
ReactantSulfuric AcidHCID 1118—
ReactantTitanium silicide (TiSi2)HCID 6336889—
ReactantAzane;hydrateHCID 12896473—
ProductHydrogen PeroxideHCID 784—
ProductSulfuric AcidHCID 1118—
ProductTitanium mononitrideHCID 93091—

Reaction Steps

In this embodiment, the first wet etching is performed using a mixed solution of the composition of H2SO4 :H2O2 =5:1 at an etchant temperature of 140° C. for 20 minutes. The amount of the titanium disilicide film of the C49 structure etched off during the first etching by this mixed solution is extremely less than the amount of the titanium disilicide film of the C49 structure etched off during the first etching by the mixed solution of ammonia water and hydrogen peroxide (under this condition, about 1 nm of the film is etched off) (FIG. 5). During the first etching by the mixed solution of sulfuric acid and hydrogen peroxide, the titanium nitride film formed during the first rapid thermal annealing is removed in about 10 minutes. In this embodiment, therefore, the first wet etching is performed for 20 minutes including margin. Since the first wet etching is performed at 140° C., the maintenance of the composition of the mixed solution is required. During the first wet etching, the titanium-excess titanium silicide (Ti5 Si3) film is only little removed. In this embodiment, therefore, the second wet etching is performed using the mixed solution having a composition of NH4OH:H2O2 :H2O=1:1:5 at room temperature for 30 minutes.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS05776822
Source datasetuspto-grants-1998_07
ORD IDord-a3f0cbb786c64e44890566b6e9c43165
Source noteuspto-grants-1998_07