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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 2038725Generated: November 2, 2026

HCID 71237747, compound → HCID 71237937, compound

https://huagongshe.com/reaction/2038725

Reaction equation

Participants

RoleNameHCIDCharge
ReactantHCID 71237747HCID 71237747—
ReactantHCID 71238252HCID 71238252—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
CatalystTetrakis(triphenylphosphine)palladiumHCID 11979704—
SolventTolueneHCID 1140—
ProductHCID 71237937HCID 7123793774.2%

Reaction Conditions

Temperature100 °C

Reaction Steps

To a solution of 6-(2-ethyl-5-fluoro-4-methoxy-phenyl)-1-(tetrahydro-pyran-2-yl)-3-trimethylstannanyl-1H-indazole (Preparation 18, 735 mg, 1.53 mmol) in toluene (6 mL) was added 2-iodo-1-(2-trimethylsilanyl-ethoxymethyl)-1,4,6,7-tetrahydro-imidazo[4,5-c]pyridine-5-carboxylic acid tert-butyl ester (Preparation 22, 805 mg, 1.68 mmol), copper (1) iodide (60 mg, 310 μmol) and tetrakis(triphenylphosphine) palladium(0) (173 mg, 150 μmol). The reaction mixture was degassed with nitrogen, heated at 100° C. for 18 hours, cooled to room temperature and concentrated in vacuo. The residue was purified by column chromatography on silica gel eluting with 20% EtOAc in toluene to give the title compound as a foam (801 mg) in a 74% yield.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS08575336B2
Source datasetuspto-grants-2013_11
ORD IDord-54bdc8a45e214f3b820712d0a612fedc
Source noteuspto-grants-2013_11