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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 2119324Generated: November 2, 2026

Oxygen → HCID 10159194, compound

https://huagongshe.com/reaction/2119324

Reaction equation

Participants

RoleNameHCIDCharge
ReactantOxygenHCID 977—
ReactantBoronic AcidHCID 61668—
Reactant4-(Hydroxymethyl)benzeneboronic acidHCID 2734706—
ReactantHCID 10142607HCID 10142607—
CatalystHCID 178418397HCID 178418397—
Solvent1,4-DioxaneHCID 31275—
ProductHCID 10159194HCID 10159194—

Reaction Conditions

Temperature75 °C

Reaction Steps

(S)-4-(4-Iodophenyl-1-sulfonyl)-2,2-dimethyl-thiomorpholine-3-carboxylic acid hydroxamide-O-Wang resin (15, Scheme 4) (5.0 g at 1 mmol/g loading, 5 mmol) was swelled in dioxane (40 mL). To this was added 4-hydroxymethylbenzene boronic acid (30 mL of a 0.5 M solution in dioxane/2.5 M aq. Na2CO3 [3 M equivalents relative to the boronic acid], 15 mmol). In a dry, oxygen free environment Pd(PPh3)4 (200 mg) was added, and the mixture was stirred while at 75° C. for 48 hours. Filtration and subsequent resin washing three times with alternating CH2Cl2 (20 mL) followed by THF (20 mL) gave the (S)-4-(4′-hydroxymethyl-biphenyl-4-sulfonyl)-2,2-dimethyl-thiomorpholine-3-carboxylic acid hydroxamide-O-Wang resin.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS06686355B2
Source datasetuspto-grants-2004_02
ORD IDord-7cb87bb2869d4b4bb22d8aea7c8cf937
Source noteuspto-grants-2004_02