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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 2215945Generated: November 5, 2026

Chlorotrimethylsilane → HCID 10193144, compound

https://huagongshe.com/reaction/2215945

Reaction equation

Participants

RoleNameHCIDCharge
ReactantChlorotrimethylsilaneHCID 6397—
ReactantLithium BromideHCID 82050—
Reactant11beta-Fluoroestra-4,6-diene-3,17-dioneHCID 11173744—
ReactantHCID 178418573HCID 178418573—
CatalystCopper iodideHCID 83717—
SolventDiethyl EtherHCID 3283—
SolventDichloromethaneHCID 6344—
SolventTetrahydrofuranHCID 8028—
Solvent2(1H)-Pyrimidinone, tetrahydro-1,3-dimethyl-HCID 81646—
ProductHCID 10193144HCID 10193144—

Reaction Conditions

Temperature0 °C

Reaction Steps

A suspension of 15.2 g (79.8 mmol) of copper iodide in 70 ml of dry tetrahydrofuran is cooled to 0° C., mixed with 28.7 g (330 mmol) of lithium bromide and 27.8 ml of DMPU, stirred first for 30 minutes at this temperature and then cooled to −30° C. While being stirred, 52 ml of methylmagnesium bromide in diethyl ether (3 molar solution) is then added in drops, stirred for another 30 minutes, and the gray-colored suspension is mixed with a solution that consists of 10.0 g (34.7 mmol) of 11β-fluoroestra-4,6-diene-3,17-dione, 24.3 ml of DMPU and 23 ml of trimethylsilyl chloride in 60 ml of dichloromethane. After the addition is completed, it is allowed to stir for another 1.5 hours between −30→−10° C., the cold bath is removed, and 35 ml of ethyl acetate is carefully added at room temperature while being stirred vigorously. For working-up, the reaction solution is diluted with ethyl acetate, washed with saturated aqueous ammonium chloride solution that is free of copper, and the organic phase is dried on sodium sulfate. The crude product is chromatographed on silica gel (hexane-ethyl acetate, gradient of up to 1:1), yield 3.1 g (30%).

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS07109360B1
Source datasetuspto-grants-2006_09
ORD IDord-b8a29fabdeb44b1fa400f371fbefaa0f
Source noteuspto-grants-2006_09