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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 228747Generated: October 30, 2026

Trimethylsilylacetylene → HCID 23078266, compound

https://huagongshe.com/reaction/228747

Reaction equation

Participants

RoleNameHCIDCharge
ReactantTrimethylsilylacetyleneHCID 66111—
ReactantDiisopropylethylamineHCID 81531—
Reactant4-[(2-Iodo-6-methyl-3-pyridyl)oxy]-6,7-dimethoxyquinolineHCID 10093673—
CatalystCopper iodideHCID 83717—
CatalystHCID 178418476HCID 178418476—
SolventTetrahydrofuranHCID 8028—
ProductHCID 23078266HCID 2307826658%

Reaction Steps

4-[(2-Iodo-6-methyl-3-pyridyl)oxy]-6,7-dimethoxyquinoline (compound 116) (84 mg), trimethylsilylacetylene (39 mg), and bis(triphenylphosphine)palladium(II) chloride (14 mg) were dissolved in tetrahydrofuran (1 ml) to prepare a solution. Diisopropylethylamine (0.2 ml) and copper iodide (3.8 mg) were added to the solution, and the mixture was stirred at room temperature for 18 hr. The reaction solution was filtered, the solvent was then removed by distillation under the reduced pressure, and the residue was purified by column chromatography using chloroform to give the title compound (45 mg, yield 58%).

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS07560558B2
Source datasetuspto-grants-2009_07
ORD IDord-f91554aa7208405b95deef8a904e7392
Source noteuspto-grants-2009_07