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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 238382Generated: October 31, 2026

Dimethylformamide → HCID 86684880, compound

https://huagongshe.com/reaction/238382

Reaction equation

Participants

RoleNameHCIDCharge
ReactantDimethylformamideHCID 6228—
ReactantTriethylamineHCID 8471—
ReactantTrimethylsilylacetyleneHCID 66111—
ReactantHCID 86684878HCID 86684878—
CatalystTriphenylphosphineHCID 11776—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
CatalystHCID 178418476HCID 178418476—
SolventEthyl AcetateHCID 8857—
ProductHCID 86684880HCID 8668488083.8%

Reaction Conditions

Temperature75 °C

Reaction Steps

Under a nitrogen atmosphere, copper(I) iodide (7 mg), bis(triphenylphosphine)palladium(II) dichloride (90 mg) and triphenylphosphine (34 mg) were added to a dimethylformamide (45 mL) solution that contained 4-iodo-1-methyl-5-[4-(trifluoromethyl)phenyl]-1H-pyrazole (4.51 g), trimethylsilylacetylene (2.26 g) and triethylamine (3.57 mL), and the obtained solution was then stirred at 75° C. for 4 hours. Thereafter, the reaction solution was diluted with ethyl acetate, and was then washed with water and a saturated saline. The organic layer was dried over anhydrous sodium sulfate, and was then concentrated under a reduced pressure. The residue was purified by column chromatography (silica gel 60N, hexane:ethyl acetate=85:15 to 70:30), so as to obtain the title compound (3.46 g).

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS08642626B2
Source datasetuspto-grants-2014_02
ORD IDord-d1e830a8122745c0a654bc42cfc8452a
Source noteuspto-grants-2014_02