Sulfuric Acid → HCID 86736610, compound

Participants

Reaction Steps

1500 ml of a copper sulfate-sulfuric acid slurry was prepared by adding copper sulfate pentahydrate crystals to an aqueous solution which contained 15 percent by volume sulfuric acid (66° Baume) and was saturated with copper sulfate at 67° F. (29.2 g/l Cu). At rest, the volume of copper sulfate pentahydrate crystals comprised about 20 percent of the total slurry volume. The slurry was agitated in a 2 liter beaker with a mechanical stirrer and copper was electrolytically plated from this slurry at a cathode current density of 80 amps per square foot using a stainless steel cathode having a submerged electrode surface area of 0.12 square feet and lead anodes. During the plating period additional crystals were added so as to maintain the crystal volume in the range of about 5 to 25 percent of the total slurry volume. At the end of three hours of plating at a temperature of 70° F., the cathode was removed and inspected. It was found that the copper had plated in a smooth fine grained deposit at a current efficiency of 99.8 percent.

Provenance & Evidence