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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 342378Generated: October 25, 2026

Benzenamine, 4,4'-[1,3-phenylenebis(oxy)]bis- → 5,5'-Carbonyldi(2-benzofuran-1,3-dione)--1-(4-aminophenyl)-1,3,3-trimethyl-2,3-dihydro-1H-inden-5-amine (1/1)

https://huagongshe.com/reaction/342378

Reaction equation

Participants

RoleNameHCIDCharge
ReactantBenzenamine, 4,4'-[1,3-phenylenebis(oxy)]bis-HCID 17201—
Reactant(1,1'-Biphenyl)-4,4'-diamine, 2,2'-bis(trifluoromethyl)-HCID 629349—
ReactantBis(aminopropyl)tetramethyldisiloxaneHCID 21585087—
ReactantDiphthalic dianhydrideHCID 57275479—
Reactant2,2-Bis(3,4-dicarboxyphenyl)hexafluoropropane dihydrideHCID 87853307—
SolventN-methyl-2-pyrrolidoneHCID 13387—
Product5,5'-Carbonyldi(2-benzofuran-1,3-dione)--1-(4-aminophenyl)-1,3,3-trimethyl-2,3-dihydro-1H-inden-5-amine (1/1)HCID 6454485—

Reaction Steps

In 11.81 kg of N-methyl-2-pyrrolidone were dissolved 0.94 kg (3.25 mols) of 1,3-bis(4-aminophenoxy)benzene, 0.936 kg (2.92 mols) of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, and 0.081 kg (0.33 mol) of bis(aminopropyl)tetramethyldisiloxane (the sum of the diamine components: 6.50 mols) as diamines and 0.764 kg (2.60 mols) of diphathalic acid dianhydride and 1,732 kg (3.90 mols) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dihydride (the sum of the tetracarboxylic acid dianhydride components: 6.50 mols) as aromatic tetracarboxylic acid dianhydrides. The resulting solution was stirred at room temperature for 24 hours. The temperature of the solution was raised to 75° C., and when the viscosity reached 5,000 c.p., heating was stopped, and the solution was allowed to stand to cool it to room temperature. By adding 0.696 kg (1.93 mols) of an N-methyl compound to the solution, a solution of a photosensitive polyimide resin precursor was prepared. After coating the solution of the photosensitive polyimide resin precursor obtained above on a long stainless steel (SUS 304) foil having a thickness of 25 μm by a continuous cater, the coating layer was dried by heating at 120° C. for 2 minutes to form the coating layer of the photosensitive polyimide resin precursor.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS05858518
Source datasetuspto-grants-1999_01
ORD IDord-51d0227ad7b54479821be8b91ef6ad7e
Source noteuspto-grants-1999_01