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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 352657Generated: October 31, 2026

Diisopropylethylamine → HCID 10172898, compound

https://huagongshe.com/reaction/352657

Reaction equation

Participants

RoleNameHCIDCharge
ReactantDiisopropylethylamineHCID 81531—
ReactantBenzylacetyleneHCID 575753—
ReactantHCID 22482181HCID 22482181—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
CatalystHCID 178418476HCID 178418476—
SolventDimethylformamideHCID 6228—
SolventEthyl AcetateHCID 8857—
ProductHCID 10172898HCID 10172898—

Reaction Conditions

Temperature50 °C

Reaction Steps

To a solution of the compound obtained in Step 1 (0.739 mmol) in 6.5 ml of DMF, is added diisopropylethylamine (0.381 g, 2.96 mmol), CuI (catalytic amount), 3-phenyl-1-propyne (0.120 g, 1.03 mmol), and Pd(PPh3)2Cl2 (catalytic amount). The reaction mixture is warmed to 50° C. for 4 hours. The mixture is then diluted with 150 ml of EtOAc, and washed with 3×100 ml of water, 1×100 ml of brine. The organic layer is then dried over MgSO4 and filtered. The filtrate is concentrated in vacuo. The crude product is triturated with 8/1: hexane/EtOAc to yield the desired compound.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS06747147B2
Source datasetuspto-grants-2004_06
ORD IDord-eef0577e9fe14f76975a841e37c3ac20
Source noteuspto-grants-2004_06