HuagongsheHuagongshe Chemistry Print Report · For research reference only
Formaldehyde → Formaldehyde;phenol
Participants
| Role | Name | HCID | Charge |
|---|---|---|---|
| Reactant | Formaldehyde | HCID 712 | — |
| Reactant | Phenol | HCID 996 | — |
| Reactant | Potassium Hydroxide | HCID 14797 | — |
| Catalyst | 2-Methylbenzenesulfonic acid | HCID 6925 | — |
| Solvent | Formic Acid | HCID 284 | — |
| Product | Formaldehyde;phenol | HCID 172281 | — |
Reaction Steps
A resole resin is made using from 1.5:1.0 up to 2.0:1.0 chemical equivalents ratio of formaldehyde:phenol catalyzed with KOH. When this reaction has proceeded to the desired viscosity, it is cooled and retarded by addition of formic acid. To this resin is added about 3 Phr of Epon epoxy resin, 3 Phr of DMP plasticizer, and about 2 Phr of a silicone surfactant. To about 70 Parts by weight (Pbw) of this mixture is added about 14 Pbw of a mixed blowing agent system such as described above, about 1.5 Pbw Arlatone "G" surfactant, about 0.1 Pbw L-5340 surfactant, and about 16 Pbw toluene sulfonic acid catalyst. This reacts to form a suitable closed cell phenolic foam.
Provenance & Evidence
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|---|
| Patent number | US05166182 |
| Source dataset | uspto-grants-1992_11 |
| ORD ID | ord-85029eec936d4c69ae74dc79eb253b0f |
| Source note | uspto-grants-1992_11 |