HuagongsheHuagongshe Chemistry Print Report · For research reference only
Dimethylformamide → Epoxide resin
Participants
| Role | Name | HCID | Charge |
|---|---|---|---|
| Reactant | Dimethylformamide | HCID 6228 | — |
| Reactant | Allylamine | HCID 7853 | — |
| Reactant | m-Chloroperbenzoic acid | HCID 70297 | — |
| Solvent | Dichloromethane | HCID 6344 | — |
| Product | Epoxide resin | HCID 16213861 | — |
Reaction Steps
To PNP resin (23a) (0.5 g, 0.77 mmol/g loading) at room temperature was added allylamine (125 μL, 1.67 mmol) in 2 mL of DMF. The resin was shaken overnight and then filtered. It was sequentially washed with DMF and DCM. After being dried in vacuo, the olefin resin (24a, 100 mg) was treated with mCPBA (80%, 72 mg, 0.355 mmol) in DCM for 16 hrs. The reaction mixture was filtered, and the resin was washed with DCM. Epoxide resin 12a was provided upon drying in vacuo. See FIG. 25.
Provenance & Evidence
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|---|
| Patent number | US06562844B2 |
| Source dataset | uspto-grants-2003_05 |
| ORD ID | ord-1d4d8a0fae3a4db081e9532579bc58df |
| Source note | uspto-grants-2003_05 |