Formaldehyde → HCID 131710823, compound

HRID 437745Notes

Reaction equation

HRID 437745 reaction equation
[SiH2:1]([OH:3])[OH:2].[C:4]1([OH:10])[CH:9]=[CH:8][CH:7]=[CH:6][CH:5]=1.[OH-].[K+].[SiH2](O)O.[C:16]1([OH:22])C=CC=CC=1.C=O>>[SiH2:1]([OH:3])[OH:2].[C:4]1([OH:10])[CH:9]=[CH:8][CH:7]=[CH:6][CH:5]=1.[CH2:16]=[O:22]

Participants

6

Reactant 5

HCID 712FormaldehydeHCID 996Phenol2×HCID 14797Potassium HydroxideHCID 16755636SilanediolHCID 131710824HCID 131710824, compound2×

Product 1

HCID 131710823HCID 131710823, compound

Procedure

One mol of monosilandiol, one mol of phenol and 0.2 mol of potassium hydroxide are mixed then heated to just below the boiling point of phenol while agitating at ambient pressure for 15 to 60 minutes, thereby producing phenol monosilandiol, a tan granular compound. The phenol monosilandiol is mixed with about 1 mol of formaldehyde in an aqueous solution, then heated to 70° to 90° C. for 20 to 100 minutes until the desired viscosity is obtained, thereby producing poly(formaldehyde phenol monosilandiol) resin. The resin may be produced as a thick liquid, soft solid or a hard solid. The resin is soluble in acetic acid, acetone and other organic solvents, and a solution of the resin may be used as an adhesive or coating on wood.

Workup

  1. temperatureheated to 70° to 90° C. for 20 to 100 minutes until the desired viscosity
  2. customis obtained

Sources & evidence

ORD record
ord-f6e38983a25e4f939a3cf36e150cac6d
Source dataset
uspto-grants-1977_06
Patent number
US04032511

Reaction notes

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