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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 466734Generated: October 30, 2026

Trimethylsilylacetylene → HCID 53678606, compound

https://huagongshe.com/reaction/466734

Reaction equation

Participants

RoleNameHCIDCharge
ReactantTrimethylsilylacetyleneHCID 66111—
ReactantHCID 18648371HCID 18648371—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
CatalystDichlorobis(triphenylphosphine)palladiumHCID 6102075—
SolventDimethylformamideHCID 6228—
SolventTriethylamineHCID 8471—
ProductHCID 53678606HCID 53678606—

Reaction Steps

A solution of the product of Stage b), (0.8 g, 1.69 mmoles), bis(triphenylphosphine) palladium (II) chloride (25 mg) and copper (I) iodide (25 mg) in dry triethylamine (40 ml) and N,N-dimethylformamide (3 ml) was degassed thoroughly with nitrogen. (Trimethylsilyl) acetylene (0.47 ml, 3.37 mmoles) was added and the mixture stirred under N2 at 50° for 8 hours. The solvent was removed under reduced pressure, the residue dissolved in methylene chloride (40 ml) and the solution washed with 2% aqueous disodium EDTA solution (4 ml), water (50 ml) and dried (sodium sulphate). Evaporation of the solvent and purification of the residue by silica column chromatography eluting with 2% MeOH/CH2Cl2 afforded the title compound. Trituration with ether/hexane afforded analytically pure title compound as an off-white powder.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS05157114
Source datasetuspto-grants-1992_10
ORD IDord-70fb651631884407b77b392e45ece73c
Source noteuspto-grants-1992_10