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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 466737Generated: October 30, 2026

Trimethylsilylacetylene → HCID 18648377, compound

https://huagongshe.com/reaction/466737

Reaction equation

Participants

RoleNameHCIDCharge
ReactantTrimethylsilylacetyleneHCID 66111—
ReactantHCID 18648376HCID 18648376—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
SolventTriethylamineHCID 8471—
ProductHCID 18648377HCID 18648377—

Reaction Steps

A mixture of the product of stage b) (0.7 g, 1.76 mmol), bis-triphenylphosphine palladium (II) chloride (0.036 g) and copper (I) iodide (36 mg) in redistilled triethylamine (35 ml) was degassed with oxygen-free nitrogen. Trimethylsilylacetylene (0.49 ml, 3.52 mmol) was added and the mixture was stirred under a nitrogen atmosphere at room temperature for 60 hours. The solvent was evaporated, the residue dissolved in dichloromethane (30 ml) and the solution washed with a 2% aqueous solution disodium EDTA (2×30 ml), water (40 ml) and dried (Na2SO4). Evaporation of the solvent and purification of the residue by silica gel column chromatography eluting with 40% ethyl acetate/toluene afforded the title compound as a foam.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS05157114
Source datasetuspto-grants-1992_10
ORD IDord-dec73dbf201644e7b65244015e08a307
Source noteuspto-grants-1992_10