Huagongshe화공사 화학 정보 인쇄 보고서 · 연구 참고용
Hydrochloric Acid → Sulfuric Acid
참여 물질
| 역할 | 이름 | HCID | 투입량 |
|---|---|---|---|
| 반응물 | Hydrochloric Acid | HCID 313 | — |
| 반응물 | Sulfuric Acid | HCID 1118 | — |
| 반응물 | Copper | HCID 23978 | — |
| 생성물 | Sulfuric Acid | HCID 1118 | — |
| 생성물 | Cupric sulfate monohydrate | HCID 61499 | — |
반응 단계
The electrolessly copper-plated test pieces were immersed in 10% sulfuric acid for 30 seconds, immersed in an electric copper plating bath containing in 1 liter thereof 75 g of CuSO4.H2O, 180 g of sulfuric acid, 0.125 ml of 35% hydrochloric acid and 5 ml of Cu-Brite TH, a brightener produced by EBARA-UDYLITE, copper electroplated at a current density of 3A/dm2 for about 1 hour to a thick thickness of copper of about 35 micrometers, and then water washed with deionized water for 1 minute.
출처 및 근거
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|---|
| 특허 번호 | US05230927 |
| 출처 데이터셋 | uspto-grants-1993_07 |
| ORD ID | ord-2c06b92ff59b4a19ba8e398a6d7c18f6 |
| 출처 메모 | uspto-grants-1993_07 |