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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 583315Generated: October 30, 2026

Trimethylsilylacetylene → HCID 86754307, compound

https://huagongshe.com/reaction/583315

Reaction equation

Participants

RoleNameHCIDCharge
ReactantTrimethylsilylacetyleneHCID 66111—
ReactantHCID 70052828HCID 70052828—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
CatalystDichlorobis(triphenylphosphine)palladiumHCID 6102075—
SolventDiethyl EtherHCID 3283—
SolventDimethylformamideHCID 6228—
SolventTriethylamineHCID 8471—
ProductHCID 86754307HCID 8675430780%

Reaction Steps

To a solution of 0.277 g (0.50 mmol) of the product of Example 11 in 2.0 mL of DMF and 2.0 mL of triethylamine was added 0.39 mL (0.2.748 mmol) of trimetylsilyl acetylene, 19 mg (0.027 mmol) of bis(triphenylphosphine)palladium(II)dichloride and 2.6 mg of copper(I)iodide. The reaction mixture was then heated to 65 degrees for 2 h and then cooled to room temperature and diluted with ether. The organics were washed with 5% Hcl solution, water and brine, dried over MgSO4, filtered and concentrated in vacuo. The residue was dissolved in 5 mL of THF, 1 mL of 1M tetrbutylammonium fluoride-THF solution was added and the reaction was stirred at room temperatue for 1 h, then diluted with ether, washed with 5% HCl solution, water and brine, dried over MgSO4, filtered and concentrated in vacuo. The residue was chromatographed on silica eluting with EtOAc-Hex (1:10) to provide 0.197 g (80%) of the desired product as a white foam. Electrospray Mass Spec: 450.3 (M+H)+.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS05929097
Source datasetuspto-grants-1999_07
ORD IDord-2547104c9e5247c28934493ebcc1f25c
Source noteuspto-grants-1999_07