Back
HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 735840Generated: October 30, 2026

Diisopropylethylamine → HCID 67189229, compound

https://huagongshe.com/reaction/735840

Reaction equation

Participants

RoleNameHCIDCharge
ReactantDiisopropylethylamineHCID 81531—
Reactant1-(1-Naphthyl)ethylamineHCID 98089—
ReactantHCID 67187025HCID 67187025—
CatalystTetrabutylammonium IodideHCID 67553—
SolventN-methyl-2-pyrrolidoneHCID 13387—
ProductHCID 67189229HCID 67189229—

Reaction Conditions

Temperature80 °C

Reaction Steps

The resin-bound 4-chloromethyl-N-dodecyl-benzamide (described in step b, 0.0426 mmol) was swelled in NMP (0.25 mL) for 15 min at rt. DIEA (33 mg, 0.256 mmol), tetrabutyl-ammonium iodide (94.4 mg, 0.256 mmol) and 1-naphthalen-1-yl-ethylamine (44 mg, 0.256 mmol) dissolved in NMP (0.75 mL) were added and the reaction mixture was shaken 14 h at 80° C. The resin was washed successively with THF (1×15 min), MeOH (1×15 min), THF (1×15 min), MeOH (3×10 min), DMF (3×10 min), MeOH (1×5 min), THF (3×10 min), MeOH (1×5 min), DCM (3×10 min) and with Et2O (1×10 min). The resin was then dried under vacuum to afford the resin-bound N-dodecyl-4-({[1-(1-naphthyl)ethyl]amino}-methyl)benzamide which was used directly in the next step.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS07592477B2
Source datasetuspto-grants-2009_09
ORD IDord-a09bb88c449149258ae549893e6eb62f
Source noteuspto-grants-2009_09