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HuagongsheHuagongshe Chemistry Print Report · For research reference only
HRID 984632Generated: October 29, 2026

Hexylamine → HCID 69503044, compound

https://huagongshe.com/reaction/984632

Reaction equation

Participants

RoleNameHCIDCharge
ReactantHexylamineHCID 8102—
ReactantDodecaneHCID 8182—
Reactant2,6-DimethylphenolHCID 11335—
ReactantPotassium Phosphate, TribasicHCID 62657—
Reactanto-IodoanisoleHCID 68257—
CatalystCopper(1+) iodide; Copper(I) iodide; Cuprous iodide; Cuprous iodide (CuI)HCID 24350—
SolventWaterHCID 962—
SolventDiethyl EtherHCID 3283—
ProductHCID 69503044HCID 69503044—

Reaction Conditions

Temperature80 °C

Reaction Steps

Copper (I) iodide (10 mg, 0.05 mmol, 5 mol %), anhydrous fine powder potassium phosphate (425 mg, 2.0 mmol) and 2,6-dimethylphenol (24 mg, 0.2 mmol, 20 mol %) were put into a screw-capped test tube with a Teflon septum. The tube was evacuated and back-filled with argon (3 cycles). 2-Iodoanisole (130 μL, 1.0 mmol) and n-hexylamine (158 μL, 1.0 mmol) were added by micro-syringe at room temperature. The reaction mixture was heated at 80° C. for 18 hours. The reaction mixture was then allowed to reach room temperature. Diethyl ether (2 mL), water (2 mL) and dodecane (internal standard, 227 μL) were added. The organic layer was analyzed by GC to give 41% GC yield of N-(2-methoxyphenyl)hexylamine.

Provenance & Evidence

DOI10.6084/m9.figshare.5104873.v1
Patent numberUS06867298B2
Source datasetuspto-grants-2005_03
ORD IDord-c24b2a313dae443bb29def8279c24a54
Source noteuspto-grants-2005_03