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llms.txt · MCP-AnleitungDatenschutz · Nutzungsbedingungen · Supportv1.8.0
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Sodium Hydroxide → Tris(hydroxymethyl)aminomethane

HRID 1791094
Notizen
Druckvorschau

Reaktionsgleichung

Reaktionsgleichung von HRID 1791094
[OH-:1].[Na+:2].[CH2:3]([OH:10])[C:4]([NH2:9])([CH2:7][OH:8])[CH2:5][OH:6].Cl>C(O)C(N)(CO)CO.C(N(CC(O)=O)CC(O)=O)CN(CC(O)=O)CC(O)=O>[CH2:3]([OH:10])[C:4]([NH2:9])([CH2:7][OH:8])[CH2:5][OH:6].[OH-:1].[Na+:2]
KomponentenReaktionsbedingungenVersuchsvorschriftAufarbeitungQuellen und NachweiseNotizen zur Reaktion

Komponenten

5

Edukt 2

HCID 14798Sodium HydroxideHCID 93573Tromethamine hydrochloride

Produkt 2

HCID 6503Tris(hydroxymethyl)aminomethaneHCID 14798Sodium Hydroxide

Reagenzien, Katalysatoren, Lösungsmittel 1

HCID 16218629Glycine, N,N'-1,2-ethanediylbis(N-(carboxymethyl)-, compd. with 2-amino-2-(hydroxymethyl)-1,3-propanediol (1:2)Lösungsmittel

Reaktionsbedingungen

Temperatur
70 °C

Versuchsvorschrift

To determine if heating the damaged DNA in the presence of salt can improve the amplification of this substrate, damaged DNA (25 ngs) was heated to 70° C. in the presence of a salt (Tris-EDTA (10 mM Tris pH 8.0 and 1 mM EDTA)) for 3 minutes, 25 ngs of native damaged sample was added back, and then the sample was cooled. This method showed some improvement on the repair of the damaged DNA. When 25 mM final of NaOH was added to the reaction before the heat step, this improved the repair method giving consistent repair of the damaged DNA. This was done by diluting damaged DNA in Tris-EDTA (TE) to 5 ng/μl, 25 ngs of DNA was added to NaOH final concentration 25 mM, the sample was heated to 70° C. for 3 minutes, Tris-HCl pH 4.0 was added to reduce the pH to 8.0, 25 ngs of the original native damaged DNA sample was added back, and the mixture was cooled to room temperature. Repair with heat, Tris, and NaOH gave better locus representation than the no repair and repair with heat and Tris only treatments.

Aufarbeitung

  1. additionby diluting
  2. additionwas added back
  3. temperaturethe mixture was cooled to room temperature
  4. temperatureRepair with heat

Quellen und Nachweise

ORD-Eintrag
ord-ae3fde27d5384a0abeb45a1cc4589100
Quelldatensatz
uspto-grants-2006_07
DOI
10.6084/m9.figshare.5104873.v1
Patentnummer
US07074600B2

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