Diisopropylethylamine → HCID 131723228, Verbindung

HRID 1937814Notizen

Reaktionsgleichung

Reaktionsgleichung von HRID 1937814
[C:1]([C:3]1[CH:18]=[CH:17][C:6]([CH2:7][CH:8]([C:12]([N:14]([CH3:16])[CH3:15])=[O:13])[C:9]([OH:11])=O)=[CH:5][CH:4]=1)#[N:2].[CH3:19][O:20][C:21]([C@@H:23]([NH2:30])[CH:24]1[CH2:29][CH2:28][CH2:27][CH2:26][CH2:25]1)=[O:22].Cl.[B-](F)(F)(F)F.CCOC(C(C#N)=NOC(N(C)C)=[N+](C)C)=O.C(N(C(C)C)CC)(C)C>CN(C)C=O>[CH3:19][O:20][C:21](=[O:22])[C@@H:23]([NH:30][C:9](=[O:11])[CH:8]([C:12](=[O:13])[N:14]([CH3:16])[CH3:15])[CH2:7][C:6]1[CH:5]=[CH:4][C:3]([C:1]#[N:2])=[CH:18][CH:17]=1)[CH:24]1[CH2:25][CH2:26][CH2:27][CH2:28][CH2:29]1

Komponenten

6

Edukt 4

HCID 81531DiisopropylethylamineHCID 2733286O-[(Ethoxycarbonyl)cyanomethylenamino]-N,N,N',N'-tetramethyluronium tetrafluoroborateHCID 17747951(S)-Methyl 2-amino-2-cyclohexylacetate hydrochlorideHCID 22667660HCID 22667660, Verbindung

Produkt 1

HCID 131723228HCID 131723228, Verbindung

Reagenzien, Katalysatoren, Lösungsmittel 1

HCID 6228DimethylformamideLösungsmittel

Reaktionsbedingungen

Temperatur
-10 °C

Versuchsvorschrift

2-(R,S)-(4-Cyano-benzyl)-N,N-dimethyl-malonamic acid (10 g, 40.6 mmol) and L-cyclohexylglycine methylester hydrochloride (8.3 g, 40 mmol) were dissolved in dimethylformamide (500 ml). After cooling to −10° C. TOTU (13.1 g, 40 mmol) and diisopropylethylamine (10.34 g, 80 mmol) were added. The mixture was stirred for 1 hour and then allowed to warm to room temperature. After evaporation ethyl acetate was added to the residue and the organic layer was extracted with aqueous sodium hydogen carbonate solution, potassium hydrogen sulfate solution and water. The organic layer was evaporated. Yield: 14.53 g (90%); MS m/z: 400.3 (M+H)+.

Aufarbeitung

  1. temperatureto warm to room temperature
  2. customAfter evaporation ethyl acetate
  3. additionwas added to the residue
  4. extractionthe organic layer was extracted with aqueous sodium hydogen carbonate solution, potassium hydrogen sulfate solution and water
  5. customThe organic layer was evaporated

Quellen und Nachweise

ORD-Eintrag
ord-6da3d8a95b41443bbc9f7fa99ce9cd3b
Quelldatensatz
uspto-grants-2002_05
Patentnummer
US06395737B1

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