Silicon oxide (SiO)
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10097-28-6O=[Si]LIVNPJMFVYWSIS-UHFFFAOYSA-NSilicon monoxide is a silicon oxide.
10097-28-6、22755-01-7DTXSID7064940CHEBI:30588Gibbs energy
dielectric constant
안전 정보는 참고용이며, 공급업체의 물질안전보건자료(SDS), 관련 법규 및 전문가 평가를 대체하지 않습니다.
This chemical does not meet GHS hazard criteria for 0.9% (3 of 327) of reports.
Warning
H315 (97.9%): Causes skin irritation [Warning Skin corrosion/irritation]
P261, P264, P264+P265, P271, P280, P302+P352, P304+P340, P305+P351+P338, P319, P321, P332+P317, P337+P317, P362+P364, P403+P233, P405, and P501 (click each P-code to see the statement)
Aggregated GHS information provided per 327 reports by companies from 10 notifications to the ECHA C&L Inventory. Each notification may be associated with multiple companies.
Chemical: Silylene, oxo-
Silylene, oxo- is listed on the EPA's Chemical Data Reporting (CDR) system. Manufacturers and importers of Silylene, oxo- are required to report information about their production and use of this chemical to the EPA under the Toxic Substances Control Act (TSCA). (40 eCFR Part 711)
Silylene, oxo-: Does not have an individual approval but may be used under an appropriate group standard
12 [mg/m3]
130 [mg/m3]
790 [mg/m3]
Other (requires additional information)
Silylene, oxo-: ACTIVE
용도Silicon monoxide (SiO) is a commonly used material for a wide variety of applications with the emphasis on IR multilayer coatings and adhesion promotion. SiO sublimes and should preferably be evaporated from resistance heated boats. AREAS OF APPLICATION Multilayer coatings especially for the IR, but also the VIS range Adhesion promoter (VIS, NIR) Electronics: dielectric, insulating and protective layers Design: iridescent coatings, colored metallically reflecting coatings e.g. on sun glasses Web coating: barrier layers on polymer films
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Silicon monoxide (SiO) is another oxide of silicon, used rarely in silicon processing but quite often in thin film, hybrid Ie manufacture. It is useful there because no silicon is available for in situ growth of the dioxide, and it is deposited easily by physical vapor deposition, a process quite similar to the vacuum deposition of aluminum described. Usually the condensed oxide is nonstoichiometric, being a mixture of SiO, Si02, and Si; often, it is designated SiOx .The value of x, which ranges between 1 and 2, is influenced by the deposition conditions. The SiO source material is prepared by heating Si02 with Si, carbon, and hydrogen, or a hydrocarbon, to reduce the dioxide to the monoxide. Reduction takes place at roughly 1000°C, and SiO is formed in the vapor phase. This temperature is much too low to produce a significant vapor pressure of Si02, so the two oxides may be separated. The monoxide vapor is condensed out and subsequently powdered. This material, which is suitable for evaporation, is available commercially and need not be prepared by the IC manufacturer.