HCID 21910299, compound → HCID 131731054, compound

HRID 2045756Notes

Reaction equation

HRID 2045756 reaction equation
[SH:1][CH:2]([OH:8])[CH2:3][CH2:4][CH2:5][CH2:6][CH3:7]>C(S)CCCCCCCCC.[Cu]>[CH2:2]([SH:1])[CH2:3][CH2:4][CH2:5][CH2:6][CH2:7][CH2:2][CH2:3][CH2:4][CH3:5].[SH:1][CH:2]([OH:8])[CH2:3][CH2:4][CH2:5][CH2:6][CH3:7]

Participants

4

Reactant 1

HCID 21910299HCID 21910299, compound

Product 1

HCID 131731054HCID 131731054, compound

Reagents, catalysts & solvents 2

HCID 23978CopperCatalystHCID 89171-DecanethiolSolvent

Procedure

The SAM functionalized SERS active surfaces were prepared in two steps, as shown in FIG. 26. First, AgFON surfaces were fabricated by drop-coating 10 μl of 390 nm diameter nanosphere solution onto clean copper substrates, and then depositing a 200-nm-thick Ag film onto the nanosphere mask. The AgFON substrates were then incubated in 1 mM decanethiol (DT) for 45 minutes and subsequently transferred to 1 mM mercaptohexanol (MH) solution for at least 12 hours to form a mixed DT/MH SAM. The substrates were kept in 1 mM MH in ethanol prior to surgically implantation.

Workup

  1. customThe SAM functionalized SERS active surfaces were prepared in two steps

Sources & evidence

ORD record
ord-31596570010e495890aa289b88ad459e
Source dataset
uspto-grants-2013_11
Patent number
US08592226B2

Reaction notes

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