Glycidoxypropyltrimethoxysilane → Fluoren-1-amine

HRID 2255366Notes

Reaction equation

HRID 2255366 reaction equation
CC(C)=C1C(C2C=CC(OCC(O)CO)=CC=2)C=CC=C1.C[C@@:23]1(O)[C:38]2C=CC=C(O)[C:37]=2[C:36](O)=[C:35]2[CH:24]1C[CH:26]1[C@:32](O)([C:33]2=O)[C:31](O)=[C:30](C(N)=O)[C:28](=O)[CH:27]1[N:50](C)C.Cl.CC1C=C(C2(C3C=CC(N)=C(C)C=3)C3C=CC=CC=3C3C2=CC=CC=3)C=CC=1N.OS(C(F)(F)F)(=O)=O.C(C1NC=C(C)N=1)C.C(OCCC[Si](OC)(OC)OC)C1OC1>CC(CC)=O>[C:27]1([NH2:50])[C:26]2[CH2:36][C:35]3[C:33](=[CH:37][CH:38]=[CH:23][CH:24]=3)[C:32]=2[CH:31]=[CH:30][CH:28]=1

Participants

8

Reactant 6

HCID 17317GlycidoxypropyltrimethoxysilaneHCID 62406Trifluoromethanesulfonic acidHCID 218721504,4'-(9H-Fluorene-9,9-diyl)bis(2-methylaniline)HCID 54681982HCID 54681982, compoundHCID 85771059HCID 85771059, compoundHCID 178437635HCID 178437635, compound

Product 1

HCID 22817Fluoren-1-amine

Reagents, catalysts & solvents 1

HCID 6569Methyl Ethyl KetoneSolvent2×

Procedure

The silvered beads of the stretched polyester film of Example 1 were transferred to the thermosetting adhesive layer of a transfer tape, the carrier of which was biaxially oriented poly(ethyleneterephthalate) film 50 μm in thickness and having a low-adhesion surface treatment. The thermosetting adhesive layer had been made by mixing together 25 parts of PKHC, a phenoxy resin from the Union Carbide Corporation, 55 parts of Quatrex 1010, a diglycidyl ether of bisphenol A epoxy resin from the Dow Chemical Company, and 38 parts of 9,9-bis(3-methyl-4-aminophenyl) fluorene (hereinafter BAFOT). The first two of these three constituents were stirred to a uniform paste, using methylethylketone (MEK) as a solvent for the solution of the phenoxy and epoxy resins, followed by blending in the relatively insoluble BAFOT, and dilution of the resultant paste to 50% solids by weight with additional MEK. The BAFOT fluorene-amine curative was prepared for dispersion in this epoxy resin system by jet milling to a mean particle size of <5 μm. To this dispersion were added 4 parts of an accelerator, the triflic acid half salt of 2-ethyl-4-methylimidazole and 1.26 parts of an adhesion promoter, hydrolyzed (3-glycidoxypropyl)trimethoxysilane. The epoxy adhesive system was coated onto the carrier from this 50% solids by weight dispersion. The coating was applied by knife coater at room temperature, followed by air drying for 30 minutes, and one minute drying at 80° C. in a forced air oven. The dry coating thickness was about 25 μm.

Workup

  1. additionby mixing together 25 parts of PKHC
  2. additionTo this dispersion were added 4 parts of an accelerator
  3. customwas applied by knife coater at room temperature
  4. customdrying for 30 minutes
  5. customone minute drying at 80° C. in a forced air oven

Sources & evidence

ORD record
ord-4f82d286d73543abb4b46afc817c234b
Source dataset
uspto-grants-1993_08
Patent number
US05240761

Reaction notes

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