Participants
| Role | Name | HCID | Charge |
|---|
| Reactant | Copper oxide | HCID 14829 | — |
| Reactant | Pyridinium acetate | HCID 165292 | — |
| Product | Cupric acetate | HCID 8895 | — |
Reaction Steps
A 0.4M solution of Cu(OAc)2 (0.5 g) in pyridine/HOAc (~4:1) was prepared at a temperature of approximately 120° C., generating a homogenous precursor solution. Thin films were deposited and heat treated on a 300° C. hot plate and then heated to 650° C. to form the copper oxide thin film.
Provenance & Evidence
| DOI | 10.6084/m9.figshare.5104873.v1 |
|---|
| Patent number | US06086957 |
|---|
| Source dataset | uspto-grants-2000_07 |
|---|
| ORD ID | ord-562343921d6144f3907f425ac862685f |
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| Source note | uspto-grants-2000_07 |
|---|
